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Arlon CuClad 217 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate

Category Polymer , Thermoplastic , Fluoropolymer , PTFE
Manufacturer Arlon
Trade Name CuClad
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Arlon CuClad 217 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate.pdf
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Material Notes:
CuClad 217 uses a low fiberglass/PTFE ratio to provide the lowest dielectric constant and dissipation factor available in fiberglass reinforced PTFE based laminates. Together, these properties offer faster signal propagation and higher signal/noise ratios.Cross Plied Woven Fiberglass, alternating plies are oriented 90° to each otherHigh PTFE to Glass RatioBetter dielectric constant uniformity than comparable non-woven fiberglass reinforced laminatesBenefits:Electrical and Mechanical isotropy in the X-Y PlaneExtremely Low LossWell Suited for Er Sensitive CircuitsTypical Applications:Military Electronics (Radars, ECM, ESM)Microwave Components (Filters, Couplers, LNAs, etc.)Information provided by Arlon Materials for Electronics (MED).
Physical Properties Metric English Comments
Density 2.23 g/cc
0.0806 lb/in³
ASTM D792 Method A
Water Absorption 0.020 %
0.020 %
IPC TM-650 2.6.2.2
Outgassing - Total Mass Loss 0.00 %

@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.00 %

@Pressure <=1.93e-8 psi,
Temperature 257 °F
Water Vapor Recovered; NASA SP-R-0022A
0.010 %

@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.010 %

@Pressure <=1.93e-8 psi,
Temperature 257 °F
Collected Volatiles; NASA SP-R-0022A
0.010 %

@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.010 %

@Pressure <=1.93e-8 psi,
Temperature 257 °F
NASA SP-R-0022A
Mechanical Properties Metric English Comments
Tensile Strength 45.5 MPa
6600 psi
Cross; ASTM D882
60.7 MPa
8800 psi
Machine; ASTM D882
Modulus of Elasticity 1.51 GPa
219 ksi
Cross; ASTM D638
1.90 GPa
275 ksi
Machine; ASTM D638
Flexural Modulus >= 2.46 GPa
>= 357 ksi
ASTM D790
Compressive Modulus 1.63 GPa
237 ksi
ASTM D695
Peel Strength 2.45 kN/m
14.0 pli
After Thermal Stress; IPC TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 28.0 µm/m-°C

@Temperature 0.000 - 100 °C
15.6 µin/in-°F

@Temperature 32.0 - 212 °F
y direction; IPC TM-650 2.4.24
29.0 µm/m-°C

@Temperature 0.000 - 100 °C
16.1 µin/in-°F

@Temperature 32.0 - 212 °F
x direction; IPC TM-650 2.4.24
CTE, linear, Transverse to Flow 246 µm/m-°C

@Temperature 0.000 - 100 °C
137 µin/in-°F

@Temperature 32.0 - 212 °F
z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.261 W/m-K

@Temperature 100 °C
1.81 BTU-in/hr-ft²-°F

@Temperature 212 °F
ASTM E1225
Flammability, UL94 V-0
V-0
Vertical Burn
Electrical Properties Metric English Comments
Volume Resistivity 2.30e+14 ohm-cm
2.30e+14 ohm-cm
C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 3.40e+12 ohm
3.40e+12 ohm
C96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 2.17 - 2.2

@Frequency 1.00e+6 Hz
2.17 - 2.2

@Frequency 1.00e+6 Hz
C23/50; IPC TM-650 2.5.5.3
2.17 - 2.2

@Frequency 1.00e+10 Hz
2.17 - 2.2

@Frequency 1.00e+10 Hz
C23/50; IPC TM-650 2.5.5.5
Dielectric Breakdown >= 45000 V
>= 45000 V
D48/50; ASTM D149
Dissipation Factor 0.00090

@Frequency 1.00e+10 Hz
0.00090

@Frequency 1.00e+10 Hz
C23/50; IPC TM-650 2.5.5.5
Arc Resistance >= 180 sec
>= 180 sec
D48/50; ASTM D495
Descriptive Properties Value Comments
Temperature Coefficient of Dielectric (ppm/°C) -151
IPC TM-650 2.5.5.5 (-10 - 140°C)
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