Polymer Property : Thermal Conductivity = 0.154 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.154 W/m-K	1.07 BTU-in/hr-ftÂ²-Â°F	ASTM D2214
Lord Adhesives Thermosetâ„¢ SC-300M Silicone Gel Encapsulant SC-300M is a two-part, rapid curing, platinum-catalyzed, addition cured, silicone gel. It has an extremely soft, gel-like consistency when cured, and has excellent unprimed adhesion to most substrat..
Thermal Conductivity	0.154 W/m-K	1.07 BTU-in/hr-ft²-°F	Melt
Covestro Bayblend® T85 Polycarbonate + ABS General purpose injection molding gradeVicat/B 120 temperature = 131°Chigh impact and notched impact strengthPreprocessingMax. Water content
Thermal Conductivity	0.154 W/m-K	1.07 BTU-in/hr-ft²-°F	Melt
Covestro Bayblend® T85 XF Polycarbonate + ABS General purpose injection molding gradeVicat/B 120 temperature = 130°Cbetter flow than T85PreprocessingMax. Water content
Thermal Conductivity	0.154 W/m-K @Temperature 100 °C	1.07 BTU-in/hr-ft²-°F @Temperature 212 °F
Dow SPECFLEX™ NC 630 Polyol SPECFLEX™ NC 630 polyol is a high functionality capped polyol. Its high molecular weight and primary hydroxyl content make it well suited for high resilience, flexible molded foams. CAS# 009082..
Thermal Conductivity	0.154 W/m-K	1.06 BTU-in/hr-ft²-°F
Cytec EN-2555 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Thermal Conductivity	0.154 W/m-K @Thickness 6.35 mm, Temperature 44.3 °C	1.07 BTU-in/hr-ft²-°F @Thickness 0.250 in, Temperature 112 °F
3M Scotch-Weld™ DP125 Translucent Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP125 Translucent is a faster curing version of 3M Scotch-Weld Epoxy Adhesive 2216 Translucent B/A. The worklife and cure time has been reduced from hours and days ..