Polymer Property : CTE, linear = 16.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	12.0 - 16.0 µm/m-°C @Temperature -40.0 - 125 °C	6.67 - 8.90 µin/in-°F @Temperature -40.0 - 257 °F	X/Y; IPC-TM-650.2.4.41
Park Electrochemical Nelco® N4000-2 Multifunctional Epoxy Laminate and Prepreg The Nelco® N4000-2 is the most established material of Nelco’s product line. This multifunctional epoxy laminate and prepreg system has a long history of use and one of the broadest operating and ..
CTE, linear	14.0 - 16.0 Âµm/m-Â°C @Temperature 20.0 Â°C	7.78 - 8.89 Âµin/in-Â°F @Temperature 68.0 Â°F
MMCC Al/Al2O3 3DP Particulate Aluminum Matrix Composite Cast, discontinuously reinforced aluminum matrix composite. May be fabricated by vacuum infiltration of the ceramic preform.Data provided by the manufacturer, Metal Matrix Cast Composites (MMCC).
CTE, linear	14.0 - 16.0 µm/m-°C	7.78 - 8.89 µin/in-°F
Master Bond Supreme 11AN Two Component, Heat Resistant Epoxy Adhesive Description: Master Bond Polymer Adhesive System Supreme 11AN is a two component thermally conductive heat resistant epoxy adhesive with a one-to-one mix ratio, by weight or volume. It readily devel..
CTE, linear	14.0 - 16.0 µm/m-°C	7.78 - 8.89 µin/in-°F	IPC TM-650 2.4.41
Arlon 49N Multifunctional Epoxy Low-Flow Prepreg 49N is a low-flow epoxy prepreg engineered for bonding multilayer epoxy rigid-flex or attaching heat sinks to multilayer PCBs. With a high Tg, the prepreg can be used in high-performance or high-te..
CTE, linear	14.0 - 16.0 µm/m-°C	7.78 - 8.89 µin/in-°F
Arlon 84N Polyimide Laminate and Prepreg 84N is a high performance ceramic-filled polyimide prepreg based on Arlon's 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper lay..
CTE, linear	14.0 - 16.0 µm/m-°C	7.78 - 8.89 µin/in-°F	x,y direction; IPC TM-650 2.4.41
Arlon MULTICLAD™ HF Halogen-Free Low-Loss Laminate and Prepreg System MULTICLAD™ HF represents the next generation low-loss thermoset and prepreg system for high-speed and high-frequency printed circuit boards. This technology combines a low-loss, high reliability t..
CTE, linear	13.0 - 16.0 µm/m-°C @Temperature 23.0 - 80.0 °C	7.22 - 8.89 µin/in-°F @Temperature 73.4 - 176 °F	DIN 53752
BASF Ultradur B 2550 PBT Ultradur B2550 is an unfilled, very free-flowing grade for coating paper and board with high heat resistance, for example for packaging of frozen goods and ready-prepared meals. Also suitable for in..
CTE, linear	14.0 - 16.0 µm/m-°C	7.78 - 8.89 µin/in-°F	IPC TM-650 2.4.41
Arlon 45N Multifunctional Epoxy Laminate and Prepreg Arlon 45N is a tough, high Tg (175°C by DSC) multifunctional epoxy laminate and prepreg system designed for use in a variety of higher layer count MLBs. Processable using conventional FR-4 conditi..
CTE, linear	14.0 - 16.0 µm/m-°C	7.78 - 8.89 µin/in-°F	IPC TM-650 2.4.41
Arlon 44N Multifunctional Microdispersed Ceramic Filled Epoxy-Fiberglass Prepreg Arlon 44N is a high resin content multifunctional (175°C) epoxy prepreg system with a proprietary microdispersed ceramic filler system. 44N is engineered for the filling of clearance holes in thi..