Polymer Property : Decomposition Temperature = 1020 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	548 °C	1020 °F	10% Weight Reduction
UBE UPIMOL® R Polyimide Shape Description: Ube's UPIMOL is an exceptionally heat-resistant polyimide Shape. This product has the same molecular structure as UPILEX, an ultra-high heat-resistant polyimide film developed by Ub..
Decomposition Temperature	550 °C	1020 °F	5 percent; IPC TM-650 2.4.24.6
Arlon AD255C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs For RF & Microwave Printed Circuit Boards. Very Low Loss PTFE and Ceramic Filled Composite (0.0014 Loss Tangent at 10GHz and Base Station Frequencies)Dielectric Constant (2.55) with Tighter Toleran..