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Arlon AD255C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs

Category Polymer , Thermoplastic , Fluoropolymer , PTFE
Manufacturer Arlon
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Arlon AD255C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs.pdf
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Material Notes:
For RF & Microwave Printed Circuit Boards. Very Low Loss PTFE and Ceramic Filled Composite (0.0014 Loss Tangent at 10GHz and Base Station Frequencies)Dielectric Constant (2.55) with Tighter ToleranceLow Dielectric Loss (Loss Tangent)Low Profile Copper (lower conductive losses and lowest PIM)Low Z-direction CTELarge Panel Sizes AvailableBenefits:Higher Antenna EfficienciesLower Insertion LossLow PIM for Antenna ApplicationsImproved TCEr for Phase StabilityCeramic provides Higher Degree of Dielectric Constant Stability as Temperatures Change or CycleTypical Applications:Base Station Antenna ApplicationsCommercial AntennasDigital Audio Broadcasting (DAB) Antennas (Satellite Radio)Radar Manifolds and Feed NetworksInformation provided by Arlon Materials for Electronics (MED).
Physical Properties Metric English Comments
Density 2.30 g/cc
0.0831 lb/in³
ASTM D792 Method A
Water Absorption 0.040 %
0.040 %
IPC TM-650 2.6.2.1
Mechanical Properties Metric English Comments
Tensile Strength 21.4 MPa
3100 psi
Cross; IPC TM-650 2.4.18.3
27.6 MPa
4000 psi
Machine; IPC TM-650 2.4.18.3
Modulus of Elasticity 2.76 GPa
400 ksi
IPC TM-650 2.4.18.3
Flexural Strength 61.4 MPa
8900 psi
Cross; IPC TM-650 2.4.4
74.5 MPa
10800 psi
Machine; IPC TM-650 2.4.4
Compressive Modulus >= 2.41 GPa
>= 350 ksi
ASTM D3410
Poissons Ratio 0.27
0.27
ASTM D3039
Peel Strength 2.10 kN/m
12.0 pli
To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 16.0 µm/m-°C

@Temperature 50.0 - 150 °C
8.89 µin/in-°F

@Temperature 122 - 302 °F
IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 50.0 µm/m-°C

@Temperature 50.0 - 150 °C
27.8 µin/in-°F

@Temperature 122 - 302 °F
z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.300 W/m-K
2.08 BTU-in/hr-ft²-°F
ASTM E1461
Decomposition Temperature 495 °C
923 °F
Onset; IPC TM-650 2.4.24.6
550 °C
1020 °F
5 percent; IPC TM-650 2.4.24.6
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 1.10e+15 ohm-cm
1.10e+15 ohm-cm
C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 4.50e+13 ohm
4.50e+13 ohm
C96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 2.55

@Frequency 1.00e+6 Hz
2.55

@Frequency 1.00e+6 Hz
may vary by thickness; IPC TM-650 2.5.5.3
2.55

@Frequency 1.00e+10 Hz
2.55

@Frequency 1.00e+10 Hz
may vary by thickness; IPC TM-650 2.5.5.5
Dielectric Breakdown >= 45000 V
>= 45000 V
IPC TM-650 2.5.6
Dissipation Factor 0.0011

@Frequency 1.00e+6 Hz
0.0011

@Frequency 1.00e+6 Hz
IPC TM-650 2.5.5.3
0.0015

@Frequency 1.00e+10 Hz
0.0015

@Frequency 1.00e+10 Hz
IPC TM-650 2.5.5.5
Arc Resistance >= 180 sec
>= 180 sec
IPC TM-650 2.5.1
Descriptive Properties Value Comments
IPC Delamination - T260 (minutes) >60
IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes) >60
IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes) >60
IPC TM-650 2.4.24.1
Temperature Coefficient of Dielectric (ppm/°C) -75
IPC TM-650 2.5.5.5; at 10 GHz (-40 - 150°C)
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