Polymer Property : CTE, linear = 24.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	24.0 µm/m-°C @Temperature -55.0 - 288 °C	13.3 µin/in-°F @Temperature -67.0 - 550 °F	Z-Direction; ASTM D3386-94
Rogers Corporation RO3006 Ceramic-Filled PTFE Composite, High Frequency Circuit Material Features and Benefits:
CTE, linear	24.0 µm/m-°C @Temperature 0.000 - 100 °C	13.3 µin/in-°F @Temperature 32.0 - 212 °F	X-Direction; 5°C/min; ASTM D3386
Rogers Corporation RT/duroid® 6010.2LM Ceramic-PTFE Composite Microwave Laminate Features:High dielectric constant for circuit size reductionLow loss - Ideal for operating at X-band or belowLow Z-axis expansion. Provides reliable plated through holes in multi-layer boardsTight ..
CTE, linear	24.0 µm/m-°C @Temperature 0.000 - 100 °C	13.3 µin/in-°F @Temperature 32.0 - 212 °F	Y-Direction; 5°C/min; ASTM D3386
Rogers Corporation RT/duroid® 6010.2LM Ceramic-PTFE Composite Microwave Laminate Features:High dielectric constant for circuit size reductionLow loss - Ideal for operating at X-band or belowLow Z-axis expansion. Provides reliable plated through holes in multi-layer boardsTight ..
CTE, linear	24.0 µm/m-°C @Temperature -80.0 - 225 °C	13.3 µin/in-°F @Temperature -112 - 437 °F	ESD Grade (12µm polyimide/9µm copper); ASTM E831-06
NeXolve TR-Clad™ Flexible Polyimide Laminate The lightest weight copper clad laminates available.TR-Clad™ Flexible Laminates are both the lowest weight and lowest dielectric constant of copper/polyimide laminates available. Additionally, TR..
CTE, linear	24.0 µm/m-°C @Temperature -55.0 - 288 °C	13.3 µin/in-°F @Temperature -67.0 - 550 °F	Z-Direction; IPC-TM-650 2.4.41
Rogers Corporation RO3035 Ceramic-Filled PTFE Composite, High Frequency Circuit Material Features and Benefits:Low dielectric lossExcellent mechanical properties versus temperature - reliable stripline and multi-layer board constructions.Uniform mechanical properties- ideal for multi-la..
CTE, linear	24.0 µm/m-°C @Temperature 0.000 - 100 °C	13.3 µin/in-°F @Temperature 32.0 - 212 °F	y direction; IPC TM-650 2.4.24
Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 233 uses a medium fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation factor without sacrificing mechanical properties.Cross Plied Woven Fiberglass, alternatin..