Polymer Property : CTE, linear = 13.3 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	24.0 µm/m-°C @Temperature -55.0 - 288 °C	13.3 µin/in-°F @Temperature -67.0 - 550 °F	Z-Direction; ASTM D3386-94
Rogers Corporation RO3006 Ceramic-Filled PTFE Composite, High Frequency Circuit Material Features and Benefits:
CTE, linear	24.0 µm/m-°C @Temperature 0.000 - 100 °C	13.3 µin/in-°F @Temperature 32.0 - 212 °F	X-Direction; 5°C/min; ASTM D3386
Rogers Corporation RT/duroid® 6010.2LM Ceramic-PTFE Composite Microwave Laminate Features:High dielectric constant for circuit size reductionLow loss - Ideal for operating at X-band or belowLow Z-axis expansion. Provides reliable plated through holes in multi-layer boardsTight ..
CTE, linear	24.0 µm/m-°C @Temperature 0.000 - 100 °C	13.3 µin/in-°F @Temperature 32.0 - 212 °F	Y-Direction; 5°C/min; ASTM D3386
Rogers Corporation RT/duroid® 6010.2LM Ceramic-PTFE Composite Microwave Laminate Features:High dielectric constant for circuit size reductionLow loss - Ideal for operating at X-band or belowLow Z-axis expansion. Provides reliable plated through holes in multi-layer boardsTight ..
CTE, linear	24.0 µm/m-°C @Temperature -80.0 - 225 °C	13.3 µin/in-°F @Temperature -112 - 437 °F	ESD Grade (12µm polyimide/9µm copper); ASTM E831-06
NeXolve TR-Clad™ Flexible Polyimide Laminate The lightest weight copper clad laminates available.TR-Clad™ Flexible Laminates are both the lowest weight and lowest dielectric constant of copper/polyimide laminates available. Additionally, TR..
CTE, linear	23.9 µm/m-°C @Temperature 30.0 - 80.0 °C	13.3 µin/in-°F @Temperature 86.0 - 176 °F	ramp rate 10°/min.
Nihon Superior SN100C Lead-Free Solder Alloy Allows high productivity in soldering processes and cost effective, reliable joints. Attributes include high fluidity, low copper erosion, low drossing, superior wetting and freedom from shrinkage d..
CTE, linear	24.0 µm/m-°C @Temperature -55.0 - 288 °C	13.3 µin/in-°F @Temperature -67.0 - 550 °F	Z-Direction; IPC-TM-650 2.4.41
Rogers Corporation RO3035 Ceramic-Filled PTFE Composite, High Frequency Circuit Material Features and Benefits:Low dielectric lossExcellent mechanical properties versus temperature - reliable stripline and multi-layer board constructions.Uniform mechanical properties- ideal for multi-la..
CTE, linear	24.0 µm/m-°C @Temperature 0.000 - 100 °C	13.3 µin/in-°F @Temperature 32.0 - 212 °F	y direction; IPC TM-650 2.4.24
Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 233 uses a medium fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation factor without sacrificing mechanical properties.Cross Plied Woven Fiberglass, alternatin..