Polymer Property : CTE, linear = 106 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	190 µm/m-°C @Temperature >=54.0 °C	106 µin/in-°F @Temperature >=129 °F	above Tg
Resinlab® EP1225 Black Unfilled Epoxy Adhesive Resinlab™ EP1225 Black is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. It has slightly thixotropic viscosity to give gap filling ability bust stil..
CTE, linear	190 - 220 µm/m-°C @Temperature >=180 °C	106 - 122 µin/in-°F @Temperature >=356 °F	Z-Direction; IPC-TM-650 2.4.24
Rogers Corporation Theta® MCL-HE-679G Laminate, GHA-679G Prepreg Halogen-Free, Low Dielectric Constant, High heat Resistant Multi-Layer Circuit Material Theta® circuit materials are halogen free and have good dielectric characteristics suitable for high speed digital applications. Theta materials, in part due to their superior heat resistance, hav..
CTE, linear	190 µm/m-°C @Temperature 65.0 - 140 °C	106 µin/in-°F @Temperature 149 - 284 °F	Above Tg
3M Scotch-Weld™ DP125 Translucent Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP125 Translucent is a faster curing version of 3M Scotch-Weld Epoxy Adhesive 2216 Translucent B/A. The worklife and cure time has been reduced from hours and days ..