Polymer Property : Tensile Modulus = 7.86 GPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Tensile Modulus	7.86 GPa	1140 ksi	RT; ASTM D638
Rogers Corporation XT/duroid™ 8100 0.004" Woven Glass Reinforced Thermoplastic Circuit Material XT/duroid™ 8100 woven glass reinforced thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 81..
Tensile Modulus	7.86 GPa	1140 ksi	50 mm/min; ASTM D 638
SABIC Innovative Plastics LNP Stat-kon DEP32XXC PC LNP STAT-KON* DEP32XXC is a compound based on Polycarbonate resin containing Carbon Fiber, Silicone, PTFE. Added features of this material include: Electrically Conductive.This data was supplied by..
Tensile Modulus	7.86 GPa	1140 ksi	50 mm/min; ASTM D 638
SABIC Innovative Plastics LNP Stat-kon DEP32XXC PC (Asia Pacific) LNP* STAT-KON* DEP32XXC is a compound based on Polycarbonate resin containing PTFE, Silicone, Carbon Fiber. Added features of this material include: Electrically Conductive.This data was supplied b..
Tensile Modulus	7.86 GPa	1140 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics LNP THERMOCOMP MX00709 PP LNP* THERMOCOMP* MX00709 is a compound based on Polypropylene resin containing 20% Glass Fiber. Added features of this grade are: Heat Stabilized, UV Stabilized.
Tensile Modulus	7.86 GPa	1140 ksi	1 mm/min
Arkema Group Rilsan® AZM 30 O TLD Nylon 12, 30% Glass Fiber Filled (Conditioned) Designation ISO 1874-PA12,MHLR,16-050,GF30Rigid grade with glass fiber (30%) for injection molding. Available color: natural. Light and heat stabilizing agent. Mold-release agent.High rigidity. High..