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Rogers Corporation XT/duroid™ 8100 0.004" Woven Glass Reinforced Thermoplastic Circuit Material

Category Polymer , Thermoplastic
Manufacturer Rogers Corporation
Trade Name XT/duroid™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Rogers Corporation XT/duroid™ 8100 0.004" Woven Glass Reinforced Thermoplastic Circuit Material.pdf
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Material Notes:
XT/duroid™ 8100 woven glass reinforced thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 8100 circuit materials are excellent for high frequency/high speed applications. Both dielectric constant and dissipation factor are stable over a wide range of frequencies.XT/duroid 8100 is thermally stable, with a melt temperature higher than PTFE materials and an estimated relative thermal index (RTI) greater than 210°C. The XT/duroid products possess impressive chemical and radiation resistance.Features and Benefits:Stable dielectric constant and dissipation factor over a wide frequency range - High reliability and uniform electrical properties over frequencyHigh maximum operating temperature - suitable for applications where high temperature stability is requiredExcellent chemical resistance - Ease of processing, Resistant to solvents and reagents used to process circuit boards, and Operates in harsh chemical environmentsEnvironmentally friendly - Halogen free/inherently flame retardant, Lead-free solder capable, low smoke/toxicity1/2 oz. very low profile electrodeposited copper foil claddingTypical Applications:Flex-to-install applicationsLightweight feed manifoldsSemiconductor burn-inConformal circuitryOil and gas explorationInformation provided by Rogers Corporation.
Physical Properties Metric English Comments
Moisture Absorption at Equilibrium 0.21 %
0.21 %
D24/23; IPC-TM-650 2.6.2.1
0.32 %
0.32 %
D48/50; ASTM D570
Thickness 102 microns
4.00 mil
Mechanical Properties Metric English Comments
Tensile Strength 190 MPa
27600 psi
RT; ASTM D638
Tensile Modulus 7.86 GPa
1140 ksi
RT; ASTM D638
Peel Strength 1.10 kN/m
6.30 pli
Copper; IPC-TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 19.0 µm/m-°C

@Temperature 0.000 - 150 °C
10.6 µin/in-°F

@Temperature 32.0 - 302 °F
X-Direction; IPC-TM-650 2.1.41
21.0 µm/m-°C

@Temperature 0.000 - 150 °C
11.7 µin/in-°F

@Temperature 32.0 - 302 °F
Y-Direction; IPC-TM-650 2.1.41
76.0 µm/m-°C

@Temperature 0.000 - 150 °C
42.2 µin/in-°F

@Temperature 32.0 - 302 °F
Z-Direction; IPC-TM-650 2.1.41
Thermal Conductivity 0.300 W/m-K
2.08 BTU-in/hr-ft²-°F
ASTM C518
Maximum Service Temperature, Air >= 210 °C
>= 410 °F
pending UL RTI
Glass Transition Temp, Tg 176 °C
349 °F
TMA; ASTM D3850
Flammability, UL94 V-0

@Thickness 0.102 mm
V-0

@Thickness 0.00400 in
pending
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+16 ohm-cm
1.00e+16 ohm-cm
Condition A; Z direction; IPC 2.5.17.1
Surface Resistance 1.00e+12 ohm
1.00e+12 ohm
Condition A; X, Y direction; IPC 2.5.17.1
Dielectric Constant 3.27 - 3.37

@Frequency 1.00e+10 Hz
3.27 - 3.37

@Frequency 1.00e+10 Hz
Z direction; IPC-TM-650 2.5.5.5.1
3.32

@Frequency 8.00e+9 - 4.00e+10 Hz
3.32

@Frequency 8.00e+9 - 4.00e+10 Hz
Z direction; Differential Phase Length Method
Dielectric Strength 89.4 kV/mm
2270 kV/in
Z Direction; IPC-TM-650 2.5.6.2
Dissipation Factor 0.0038

@Frequency 1.00e+10 Hz
0.0038

@Frequency 1.00e+10 Hz
Z direction; IPC-TM-650 2.5.5.5.1
Descriptive Properties Value Comments
Dimensional Stability -0.01 mm/m
Y-CMD; IPC-TM-650, 2.4.39A; 150°C bake
-0.025 mm/m
X-MD; IPC-TM-650, 2.4.39A; 150°C bake
T260 pass
Thermal Coefficient of Dielectric Constant 9 ppm/°C
IPC-TM-650 2.5.5.5.1; -100°C to 250°C
Time to Delamination (T-288) pass
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