Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Modulus | 2.63 GPa | 381 ksi | 5 mm/min; ASTM D638 |
SABIC Innovative Plastics Cycoloy® CX7259 PC (Asia Pacific) Cycoloy resin grade CX7259 is a flame retardant impact modified polycarbonate blend aiming at ultra thin wall designs. It is listed as UL-94 V1 at 0.5mm & V0 at 0.6mm with excellent flow and balance.. |
|||
Tensile Modulus | 2.63 GPa @Temperature 23.0 °C |
381 ksi @Temperature 73.4 °F |
ASTM D638 |
PolyOne Geon™ CPVC EC050 Polyvinyl Chloride, Chlorinated (CPVC) The Geon EC050 CPVC is an extrusion compound for Industrial Pipe applications where enhanced resistance at elevated temperatures is needed. Geon EC050 demonstrates ease of processing and excellent t.. |
|||
Tensile Modulus | 2.63 GPa @Temperature 23.0 °C |
381 ksi @Temperature 73.4 °F |
ASTM D638 |
PolyOne Geon™ CPVC EC950 Polyvinyl Chloride, Chlorinated (CPVC) The Geon EC950 CPVC is an extrusion compound for Industrial Pipe applications where enhanced resistance at elevated temperatures is needed. It is listed under NSF Std 14 and 61. Geon EC950 demonstra.. |
|||
Tensile Modulus | 2.63 GPa | 381 ksi | Molded; ASTM D882 |
Honeywell Aegisâ„¢ H135ZP Nylon 6 Extrusion Grade Homopolymer Film Description: Aegis H135ZP is a high viscosity, nylon 6 film extrusion grade homopolymer for cast or blown film. It conforms to Food and Drugs Administration requirements of 21 CFR 177.1500 for nylon.. |
|||
Tensile Modulus | 2.63 GPa | 381 ksi | 1 mm/min; ISO 527 |
SABIC Innovative Plastics LNP STAT-KON DX11408 PC LNP* STAT-KON* DX11408 is a compound based on Polycarbonate containing Carbon Powder. Added features of this material include: Electrically Conductive, Improved Ductility |
|||
Tensile Modulus | 2.63 GPa | 381 ksi | 5 mm/min; ASTM D638 |
SABIC Innovative Plastics LNP STAT-KON DX12411C PC LNP* STAT-KON* DX12411C is a compound based on Polycarbonate resin containing Proprietary Filler(s). Added features of this material include: Electrically Conductive, Clean Compounding System. |