Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Modulus | 3.77 GPa | 547 ksi | Storage |
Epoxy Technology EPO-TEK® EE149-6 Epoxy Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provi.. |
|||
Tensile Modulus | 3.77 GPa | 547 ksi | Storage |
Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |
|||
Tensile Modulus | 3.77 GPa | 547 ksi | 1mm/min; ISO 527 |
BASF Ultramid® C3U BK23079 PA66/6 (Dry) Ultramid C3U BK23079 is an injection molding, general purpose PA66/6, pigmented black grade with improved flame retardance. |
|||
Tensile Modulus | 3.77 GPa | 547 ksi | 5 mm/min; ASTM D638 |
SABIC Innovative Plastics LNP THERMOCOMP WF002I PBT LNP* THERMOTUF* WF006I is a compound based on PBT resin containing 10% Glass Fiber. Added feature of this grade is: High Impact. |