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Polymer Property : Tensile Modulus = 3.77 GPa Product List

Mechanical Properties

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Mechanical Properties Metric English Comments
Tensile Modulus 3.77 GPa
547 ksi
Storage
Epoxy Technology EPO-TEK® EE149-6 Epoxy
Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provi..
Tensile Modulus 3.77 GPa
547 ksi
Storage
Epoxy Technology EPO-TEK® H55 Epoxy
Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology
Tensile Modulus 3.77 GPa
547 ksi
1mm/min; ISO 527
BASF Ultramid® C3U BK23079 PA66/6 (Dry)
Ultramid C3U BK23079 is an injection molding, general purpose PA66/6, pigmented black grade with improved flame retardance.
Tensile Modulus 3.77 GPa
547 ksi
5 mm/min; ASTM D638
SABIC Innovative Plastics LNP THERMOCOMP WF002I PBT
LNP* THERMOTUF* WF006I is a compound based on PBT resin containing 10% Glass Fiber. Added feature of this grade is: High Impact.
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