Polymer Property : Compressive Modulus = 5.00 ksi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Compressive Modulus	0.0345 GPa	5.00 ksi	TM R050-38
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Compressive Modulus	0.0345 - 2.90 GPa	5.00 - 420 ksi	Average value: 1.57 GPa Grade Count:23
Overview of materials for Epoxy Encapsulant, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Encapsulant, Unreinforced". Each property range of values reported is minimum and maximum values o..
Compressive Modulus	0.0345 GPa	5.00 ksi	TM R050-38
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..