Mechanical Properties | Metric | English | Comments |
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Compressive Modulus | 0.0345 GPa | 5.00 ksi | TM R050-38 |
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |
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Compressive Modulus | 0.0345 - 2.90 GPa | 5.00 - 420 ksi | Average value: 1.57 GPa Grade Count:23 |
Overview of materials for Epoxy Encapsulant, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Encapsulant, Unreinforced". Each property range of values reported is minimum and maximum values o.. |
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Compressive Modulus | 0.0345 GPa | 5.00 ksi | TM R050-38 |
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |