Polymer Property : Compressive Modulus = 237 ksi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Compressive Modulus	1.63 GPa	237 ksi	ASTM D695
Arlon CuClad 217 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 217 uses a low fiberglass/PTFE ratio to provide the lowest dielectric constant and dissipation factor available in fiberglass reinforced PTFE based laminates. Together, these properties offe..
Compressive Modulus	1.63 GPa	237 ksi	ASTM D695
Arlon DiClad 880 PTFE/Woven Fiberglass Laminate Extremely Low Loss TangentExcellent Dimensional StabilityProduct Performance UniformityBenefits:Electrical Properties are highly uniform across frequencyConsistent Mechanical PerformanceExcellent Ch..