Polymer Property : Storage Temperature = 75.0 °F Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Storage Temperature	23.9 °C	75.0 °F	6 months
Master Bond EP13 High Temperature Resistant One Component Epoxy System Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. EP13 forms rigid and dimensionally stable bonds with minimal ..
Storage Temperature	23.9 °C	75.0 °F	3 months, minimum
Master Bond EP15 High Tensile Strength One Component Epoxy Master Bond Polymer System EP15 is a one component, heat curing epoxy featuring high tensile strength utilized in testing the adhesion and/or cohesive strength of flame-sprayed coatings. This standa..
Storage Temperature	23.9 °C	75.0 °F	4 months
Master Bond EP19HT One Component, Storage Stable Epoxy System Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features excellent storage c..
Storage Temperature	23.9 °C	75.0 °F	6 months
Master Bond Supreme 10HT One Component, Low Outgassing, Toughened Epoxy System Master Bond Supreme 10HT features a unique blend of performance properties including both high shear and peel strengths along with convenient handling. Supreme 10HT is room temperature storable and ..
Storage Temperature	23.9 °C	75.0 °F	3 months
Master Bond Supreme 10HTS Silver Filled Electrically Conductive One Part Epoxy Master Bond Supreme 10HT/S is a one component, no mix high purity silver conductive system formulated to cure at elevated temperatures. Tensile shear strengths greater than 1,200 psi and T-peel stre..
Storage Temperature	23.9 °C	75.0 °F	6 months
Master Bond Supreme 3HT High Bond Strength One Component Epoxy Adhesive System Master Bond Polymer System Supreme3HT is a storage stable one component, heat curing epoxy adhesive featuring a hither to unattainable balance of performance properties including both high shear and..
Storage Temperature	23.9 °C	75.0 °F	6 months
Master Bond Supreme 3HTND-2GT Toughened, Fast Curing, One Part Glob Top Adhesive Master Bond Polymer System Supreme 3HTND-2GT is a fast curing, toughened one component high performance epoxy adhesive/sealant which meets the growing need for precise positioning and bonding of mic..
Storage Temperature	23.9 °C	75.0 °F	6 months
Master Bond EP36 High Temperature Resistant, Toughened Epoxy System Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, coatings and bonding applications. It features an ou..
Storage Temperature	23.9 °C	75.0 °F	6 months
Master Bond EP3HT Fast Curing One Component Epoxy System Master Bond Polymer System EP3HT is a one component system featuring high shear strength and good temperature resistance along with a fast cure schedule. Master Bond Polymer System EP3HT produces du..
Storage Temperature	23.9 °C	75.0 °F	6 months
Master Bond EP3HTMED One Component, Biocompatible Epoxy System Master Bond Polymer System EP3HTMed combines the ease of a one part, no mix, fast curing adhesive with high shear strength. This special formulation fully meets USP Class VI requirements. EP3HTMed p..
Storage Temperature	23.9 °C	75.0 °F	6 weeks
Master Bond EP3SP5FL High Shear and High Peel Strength One Component Epoxy “Snap” cure version of EP3FL. Fastest curing system available. Ideal for high speed manufacturing & production. Good physical properties. Bonds well to most substrates.
Storage Temperature	23.9 °C	75.0 °F	3 months
Master Bond Supreme 10HTN Nickel Filled Electrically Conductive One Part Epoxy Master Bond Polymer System Supreme 10HTN combines high shear and high peel strengths, relatively low resistance, and exceptionally easy processing. This one component (no mix) high purity nickel con..