Polymer Property : Thickness = 0.551 mil Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Thickness	10.0 - 14.0 microns	0.394 - 0.551 mil	Fired
Lord Adhesives Metech 3288 Silver Conductor This product is a silver paste composition designed for screen print application of a solderable electrode base onto various types of electrical ceramic component devices. The fired film forms a hig..
Thickness	12.0 - 14.0 microns	0.472 - 0.551 mil	Fired
Lord Adhesives Metech 3541 Platinum Silver Conductor Composition These conductor compositions employ a state of the art mixed bond frit system to enhance adhesion and conductivity values while offering a range of cost effective conductors compatible with most res..
Thickness	12.0 - 14.0 microns	0.472 - 0.551 mil	Fired
Lord Adhesives Metech 3542 Platinum Silver Conductor Composition These conductor compositions employ a state of the art mixed bond frit system to enhance adhesion and conductivity values while offering a range of cost effective conductors compatible with most res..
Thickness	12.0 - 14.0 microns	0.472 - 0.551 mil	Fired
Lord Adhesives Metech 3543 Platinum Silver Conductor Composition These conductor compositions employ a state of the art mixed bond frit system to enhance adhesion and conductivity values while offering a range of cost effective conductors compatible with most res..
Thickness	12.0 - 14.0 microns	0.472 - 0.551 mil	Fired
Lord Adhesives Metech 3540 Platinum Silver Conductor Composition These conductor compositions employ a state of the art mixed bond frit system to enhance adhesion and conductivity values while offering a range of cost effective conductors compatible with most res..
Thickness	7.00 - 14.0 microns	0.276 - 0.551 mil
Dow CYCLOTENE™ 4026-46 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ 4026-46 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf..