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Lord Adhesives Metech 3288 Silver Conductor

Category Metal , Nonferrous Metal , Precious Metal , Silver Alloy , Solder/Braze Alloy
Manufacturer Lord Adhesives
Trade Name Metech
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
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Material Notes:
This product is a silver paste composition designed for screen print application of a solderable electrode base onto various types of electrical ceramic component devices. The fired film forms a highly adherent bond to many types of substrates such as piezo-electric transducers (PZTs), NTC thermistors, alumina, steatite, and porcelain without altering the electrical and mechanical properties of the dielectric body. It is intended for lower firing applications where a higher temperature cannot be tolerated. The bonded electrode is readily solderable for external lead attachment.All information provided by Lord.
Physical Properties Metric English Comments
Brookfield Viscosity 100000 - 120000 cP

@Temperature 25.0 °C
100000 - 120000 cP

@Temperature 77.0 °F
RVT, Spindle #7 @ 20rpm
Thickness 10.0 - 14.0 microns
0.394 - 0.551 mil
Fired
Component Elements Properties Metric English Comments
Silver, Ag 67 %
67 %
Electrical Properties Metric English Comments
Surface Resistivity per Square <= 0.0030 ohm
<= 0.0030 ohm
Processing Properties Metric English Comments
Shelf Life 6.00 Month

@Temperature 25.0 °C
6.00 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Adhesion >8
lbs; Adhesion pad size 0.10"x0.10", solder 62Sn/36Pb/2Ag at 200ºC, 20 gauge pre-tinned copper wire at 90º to substrate plane.
Solder Wetting (seconds) 2-3
62Sn/36Pb/2Ag at 230ºC
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