Polymer Property : Apparent Bulk Density = 0.0267 lb/in³ Product List

Physical Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Physical Properties	Metric	English	Comments
Apparent Bulk Density	0.740 - 0.800 g/cc	0.0267 - 0.0289 lb/in³	Average value: 0.770 g/cc Grade Count:4
Overview of materials for Epoxy, Encapsulating, Glass or Mineral Filled This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Encapsulating, Glass or Mineral Filled". Each property range of values reported is minimum and ma..
Apparent Bulk Density	0.740 g/cc	0.0267 lb/in³	ISO 60
Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed &nbs Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-..
Apparent Bulk Density	0.740 g/cc	0.0267 lb/in³	Apparent density per ASTM D1895
Plenco 4100 Phenolic, Granular, Injection Molded (discontinued **) Two-stage Phenolic. PLENCO 04100 is a black two stage, medium heat resistant phenolic molding compound. It has excellent moldability characteristics and molded finish. It is used in appliance and ..
Apparent Bulk Density	0.740 g/cc	0.0267 lb/in³	ASTM D1895
Plenco Valite 4100 Novolac Phenolic, Granular, Injection Molded (discontinued **) This Valite product has been replaced by Plenco 4100. Data provided by Plenco.VALITE 4100 is a black two stage, medium heat resistant phenolic molding compound. It has excellent moldability charac..
Apparent Bulk Density	0.740 g/cc	0.0267 lb/in³
Cosmic Plastics E4940 Mineral & Glass Filled Epoxy Molding Compound, Encapsulated Grade Data provided by the manufacturer.
Apparent Bulk Density	0.740 g/cc	0.0267 lb/in³
Cosmic Plastics E486 lass Filled Epoxy Molding Compound, Electrical Grade Data provided by the manufacturer.
Apparent Bulk Density	0.740 g/cc	0.0267 lb/in³
Cosmic Plastics E487 lass Filled Epoxy Molding Compound, Electrical Grade Data provided by the manufacturer.
Apparent Bulk Density	0.740 - 0.840 g/cc	0.0267 - 0.0303 lb/in³	IS 867-1963
Amity Thermosets ATS 132 Phenolic Molding Organic, inorganic, and graphite Filler, Compression Molded Characteristics:Self lubricating ( graphite modified )Good glide propertiesGood sealing propertiesMedium or low mechanical strengthUnsuitable for electrical applicationGlossy surfaceThermal conducti..
Apparent Bulk Density	0.740 g/cc	0.0267 lb/in³
Cosmic Plastics 6120F Short Glass Fiber Filled Ortho Diallyl Phthalate Molding Compound Data provided by the manufacturer.
Apparent Bulk Density	0.740 g/cc	0.0267 lb/in³	ISO 60
Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed &n Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-..
Apparent Bulk Density	0.740 g/cc	0.0267 lb/in³	ISO 60
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..