Polymer Property : Viscosity = 4500 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	4500 - 7500 cP @Shear Rate 230 1/s, Temperature 25.0 Â°C	4500 - 7500 cP @Shear Rate 230 1/s, Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials C2071218D1 Gold Ink Gold Ink C2071218D1 is a fritted system that has been designed as a screen printing termination ink NTC components. It is also suitable for firing onto other high temperature substrates.This product..
Viscosity	4500 - 9000 cP	4500 - 9000 cP
Huntsman Araldite GZ 471 X-75 Bisphenol A Epoxy Solution Weight per Epoxide (EEW, g/eq) 450 to 530. Max color is 3.Comments/Applications: GT 7071 - 75% solids in xylene. High performance 2-package system for coatings, flooring and general purpose applic..
Viscosity	4500 cP	4500 cP
Shin-Etsu Silicones KE-3417 Silicone, RTV Adhesive Information Provided by Shin-Etsu Silicones of America, Inc.
Viscosity	4500 cP @Temperature 25.0 °C	4500 cP @Temperature 77.0 °F	After mixing
Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Adminis..
Viscosity	4500 cP	4500 cP	Haake cone and plate rheometer @ 5/sec (35mm/2° cone)
Loctite® 3566 Rapid Flow Low Profile Underfill COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp..
Viscosity	<= 4500 cP	<= 4500 cP	dynamic
Dow Corning STS ANTIFOAM STS Antifoam is especially effective in high temperature, high shear, high pressure applications such as jet dyeing and scouring processes. It can also be used in textile printing, finishing and ble..
Viscosity	4500 cP @Temperature 25.0 °C	4500 cP @Temperature 77.0 °F
Cytec EN-2552 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Viscosity	4500 cP @Temperature 25.0 °C	4500 cP @Temperature 77.0 °F
Cytec EN-2551 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Viscosity	4500 cP	4500 cP
Dymax 9001v3.1 Resilient, Low Modulus Clear Microencapsulant High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 9001v3.1 Resilient, Low Modulus Clear MicroencapsulantLowest stress potting and encapsulation on ceramic, FR-4 or fl..
Viscosity	4500 - 6000 cP	4500 - 6000 cP
Abatron AboCast/AboCure 8109-8 All-purpose, structural dielectric resin. High thermal and chemical resistance and RT cure.Processing: 100/12 ratio; Potlife: 45 min/20°C (68°F), 20 min/40°C (105°F), 10 min /60°C (140°F); mi..
Viscosity	4500 cP	4500 cP	uncured
Atom Adhesives AA-BOND FDA15 Epoxy Adhesive AA-BOND FDA15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administr..
Viscosity	4500 cP	4500 cP	Part A, RVT, #3, 20 rpm; TM R050-12
Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..
Viscosity	4500 cP	4500 cP	Part A, RVT, #3, 20 rpm; TM R050-12
Resinlab® EP1282 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..