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Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Resinlab®
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant.pdf
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Material Notes:
Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for UL Standard 94. It qualifies for a horizontal burn rating at 1.5 mm thickness and has a CTI rating of 0. The system cures at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release and a smooth high gloss surface. It has very good resistance to water, acids and bases and most organic solvents. Thermal shock and cycling properties are enhanced by its high elongation giving it the ability to absorb differences in CTE’s of substrates and potted components. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP1282 Clear will reach full cure at room temperature within 24 – 48 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 20 minutes at 100°C are typical for small castings (less than 50 grams).Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Physical Properties Metric English Comments
Specific Gravity 0.980 g/cc
0.980 g/cc
Part B; TM R050-16
1.06 g/cc
1.06 g/cc
Mixed; TM R050-16
1.14 g/cc
1.14 g/cc
Part A; TM R050-16
Water Absorption 0.66 %

@Time 86400 sec
0.66 %

@Time 24.0 hour
TM R050-35
Viscosity 2000 cP
2000 cP
Part B, RVT, #3, 20 rpm; TM R050-12
3000 cP
3000 cP
Mixed; TM R050-12
4500 cP
4500 cP
Part A, RVT, #3, 20 rpm; TM R050-12
Mechanical Properties Metric English Comments
Hardness, Shore D 40
40
TM R050-17
Tensile Strength at Break 10.3 MPa
1500 psi
TM R050-36
Tensile Strength, Ultimate 11.0 MPa
1600 psi
TM R050-36
Tensile Strength, Yield 5.52 MPa
800 psi
TM R050-36
Elongation at Break 120 %
120 %
TM R050-36
Tensile Modulus 0.0689 GPa
10.0 ksi
TM R050-36
Compressive Yield Strength 5.52 MPa
800 psi
TM R050-38
Compressive Strength 172 MPa
25000 psi
Break; TM R050-38
172 MPa
25000 psi
Ultimate; TM R050-38
Compressive Modulus 0.310 GPa
45.0 ksi
TM R050-38
Adhesive Bond Strength 11.7 MPa
1700 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Thermal Properties Metric English Comments
CTE, linear 50.0 µm/m-°C
27.8 µin/in-°F
Thermal Conductivity 0.140 W/m-K
0.972 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Glass Transition Temp, Tg 30.0 °C
86.0 °F
TM R050-25
Optical Properties Metric English Comments
Transmission, Visible 90 %
90 %
clear; thickness not quantified
Electrical Properties Metric English Comments
Volume Resistivity 2.50e+11 ohm-cm
2.50e+11 ohm-cm
Dielectric Constant 3.5

@Frequency 100 Hz,
Temperature 25.0 °C
3.5

@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 17.3 kV/mm
440 kV/in
Processing Properties Metric English Comments
Pot Life 90 - 120 min
90 - 120 min
Mass: 100g; TM R050-19
Descriptive Properties Value Comments
Color Clear
Mix Ratio 1:1
Volume
100:85
Weight
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