Polymer Property : Specific Gravity = 3.79 g/cc Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Specific Gravity	3.79 g/cc	3.79 g/cc	Part A
Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding...
Specific Gravity	3.79 g/cc	3.79 g/cc	Part A
Epoxy Technology EPO-TEK® H27D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.Advantages & Application Notes: Rheo..
Specific Gravity	3.79 g/cc	3.79 g/cc	ASTM D792
SABIC Innovative Plastics LNP THERMOCOMP RF007SXN PA 66 LNP* THERMOCOMP* RF007SXN is a Hydro-Stable, 35% Glass Fiber reinforced compound based on Nylon 66. Added features of this grade include: Heat Stabilized, NSF Listed.