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Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive.pdf
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Material Notes:
TRA-BOND FDA-15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administration Chapter 1, Sub Part B, Sections 175.105 and 175.300. This two-part adhesive is used for bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices. TRA-BOND FDA-15 is an effective electrical insulator, and it provides low permeability to gases and vapors and good resistance to water, weather, galvanic action, to petroleum solvents, lubricants and fuels, to mild acids and alkalis, and to many other organic and inorganic compounds.Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 1.15 g/cc
1.15 g/cc
Mixed
Solids Content 100 %
100 %
Reactive Solids Content
Volatile Organic Compounds (VOC) Content 3.0 g/l
3.0 g/l
Water Absorption 0.23 %
0.23 %
After 24 hours
Viscosity 4500 cP

@Temperature 25.0 °C
4500 cP

@Temperature 77.0 °F
After mixing
Mechanical Properties Metric English Comments
Hardness, Shore D 89
89
Elongation at Yield 4.0 %
4.0 %
Adhesive Bond Strength 14.5 MPa
2100 psi
Lap shear, alum to alum, 4 hrs @ 65°C
Thermal Properties Metric English Comments
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Maximum Service Temperature, Air 140 °C
284 °F
Minimum Service Temperature, Air -70.0 °C
-94.0 °F
Glass Transition Temp, Tg 100 °C
212 °F
Ultimate Tg
Electrical Properties Metric English Comments
Volume Resistivity 2.00e+14 ohm-cm
2.00e+14 ohm-cm
Dielectric Constant 4.3

@Frequency 1000 Hz
4.3

@Frequency 1000 Hz
Dielectric Strength 16.5 kV/mm
420 kV/in
Dissipation Factor 0.020

@Frequency 1000 Hz
0.020

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 60.0 - 240 min

@Temperature 65.0 °C
1.00 - 4.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 25 min
25 min
Descriptive Properties Value Comments
Color Clear
Mix Ratio, parts by weight 100/20
Resin/Hardener
Thixotropic Index 1
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