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Tra-Con Tra-Bond 77-2LTC Low Temperature Cure SMD Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond 77-2LTC Low Temperature Cure SMD Adhesive.pdf
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Material Notes:
TRA-BOND 77-2LTC one component, solvent-free, insulative epoxy adhesive is designed to cure at temperatures as low as 80°C. This adhesive is specifically designed for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 77-2LTC adhesive exhibits superior application features. Its soft, smooth consistency permits application through fine diameter needles. It exhibits no tailing or sagging. Small, uniform dots may be dispensed for capacitor and resistor attach. To satisfy the seated heights of SOT devices, narrow peaks or multiple dots may be used. TRA-BOND 77-2LTC adhesive is also ideally suited for application by screening or pin transfer.Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Viscosity 33000 cP
33000 cP
Mixed
Mechanical Properties Metric English Comments
Hardness, Shore D 90
90
Adhesive Bond Strength 15.9 MPa
2300 psi
Lap shear, alum to alum
Thermal Properties Metric English Comments
CTE, linear 44.0 µm/m-°C
24.4 µin/in-°F
Below Tg
86.0 µm/m-°C
47.8 µin/in-°F
Above Tg
Thermal Conductivity 0.500 W/m-K

@Temperature 121 °C
3.47 BTU-in/hr-ft²-°F

@Temperature 250 °F
Glass Transition Temp, Tg 80.0 °C
176 °F
Ultimate Tg
Electrical Properties Metric English Comments
Volume Resistivity 2.50e+14 ohm-cm
2.50e+14 ohm-cm
Dielectric Constant 4.2

@Frequency 1000 Hz
4.2

@Frequency 1000 Hz
Dissipation Factor 0.0080

@Frequency 1000 Hz
0.0080

@Frequency 1000 Hz
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 5.0 ppm
5.0 ppm
Ionic Impurities - K (Potassium) 5.0 ppm
5.0 ppm
Ionic Impurities - Cl (Chloride) 30 ppm
30 ppm
Processing Properties Metric English Comments
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
10.0 min

@Temperature 125 °C
0.167 hour

@Temperature 257 °F
15.0 min

@Temperature 100 °C
0.250 hour

@Temperature 212 °F
30.0 min

@Temperature 80.0 °C
0.500 hour

@Temperature 176 °F
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Device Shear grams 2000
Thick Film Resistors
Outgassing, NASA Passes
Weight Loss % 0.24
At 300°C
Working Life days 3
At 25°C
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