Tra-Con Tra-Bond 77-2LTC Low Temperature Cure SMD Adhesive

TRA-BOND 77-2LTC one component, solvent-free, insulative epoxy adhesive is designed to cure at temperatures as low as 80°C. This adhesive is specifically designed for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 77-2LTC adhesive exhibits superior application features. Its soft, smooth consistency permits application through fine diameter needles. It exhibits no tailing or sagging. Small, uniform dots may be dispensed for capacitor and resistor attach. To satisfy the seated heights of SOT devices, narrow peaks or multiple dots may be used. TRA-BOND 77-2LTC adhesive is also ideally suited for application by screening or pin transfer.Information provided by Tra-Con Inc.