Category | Polymer , Thermoset , Epoxy , Epoxy, Molded, Glass Fiber Filler , Filled/Reinforced Thermoset |
Manufacturer | Sumitomo Bakelite North America |
Trade Name | |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Sumitomo Bakelite North America 2008A Glass Reinforced Hardware Grade Epoxy.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.85 g/cc | 0.0668 lb/in³ | ASTM D792 |
Water Absorption | 0.20 % | 0.20 % | 48 hours, 50°C. ASTM D570 |
Linear Mold Shrinkage | 0.0030 - 0.0050 cm/cm | 0.0030 - 0.0050 in/in | Compression Molding. ASTM D955 |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Barcol | 72 | 72 | |
Tensile Strength, Ultimate | 62.0 MPa | 8990 psi | ASTM D638 |
Flexural Yield Strength | 124 MPa | 18000 psi | ASTM D790 |
Flexural Modulus | 15.2 GPa | 2200 ksi | ASTM D790 |
Compressive Yield Strength | 207 MPa | 30000 psi | ASTM D695 |
Izod Impact, Notched | 0.350 J/cm | 0.656 ft-lb/in | ASTM D256A |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear, Parallel to Flow | 37.0 µm/m-°C @Temperature 20.0 °C |
20.6 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Thermal Conductivity | 0.691 W/m-K | 4.80 BTU-in/hr-ft²-°F | ASTM F433 |
Deflection Temperature at 1.8 MPa (264 psi) | 260 °C | 500 °F | ASTM D648A |
Oxygen Index | 50 % | 50 % | ASTM D2863 |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Dielectric Constant | 4.0 | 4.0 | Wet; ASTM D150 |
Dielectric Strength | 12.0 kV/mm | 305 kV/in | Wet, short term. ASTM D149 |
Dissipation Factor | 0.019 @Frequency 1e+6 Hz |
0.019 @Frequency 1e+6 Hz |
Wet; ASTM D150 |
Arc Resistance | 180 sec | 180 sec | ASTM D495 |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Mold Temperature | 143 - 177 °C | 289 - 351 °F | compression/transfer molding. |
174 - 182 °C | 345 - 360 °F | injection molding. |