Category | Polymer , Thermoset , Epoxy , Epoxy, Molded, Glass Fiber Filler , Filled/Reinforced Thermoset |
Manufacturer | Sumitomo Bakelite North America |
Trade Name | |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Sumitomo Bakelite North America 1907-1 / 1907B-1 Glass Reinforced Hardware Grade Epoxy.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.95 g/cc | 0.0704 lb/in³ | ASTM D792 |
Water Absorption | 0.30 % | 0.30 % | 48 hours, 50°C. ASTM D570 |
Linear Mold Shrinkage | 0.0020 - 0.0040 cm/cm | 0.0020 - 0.0040 in/in | Compression Molding. ASTM D955 |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Barcol | 73 | 73 | |
Tensile Strength, Ultimate | 65.0 MPa | 9430 psi | ASTM D638 |
Flexural Yield Strength | 117 MPa | 17000 psi | ASTM D790 |
Flexural Modulus | 13.8 GPa | 2000 ksi | ASTM D790 |
Compressive Yield Strength | 214 MPa | 31000 psi | ASTM D695 |
Izod Impact, Notched | 0.320 J/cm | 0.599 ft-lb/in | ASTM D256A |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear, Parallel to Flow | 47.0 µm/m-°C @Temperature 20.0 °C |
26.1 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Thermal Conductivity | 0.586 W/m-K | 4.07 BTU-in/hr-ft²-°F | ASTM F433 |
Deflection Temperature at 1.8 MPa (264 psi) | 260 °C | 500 °F | ASTM D648A |
Oxygen Index | 38 % | 38 % | ASTM D2863 |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Dielectric Constant | 4.0 | 4.0 | Wet; ASTM D150 |
Dielectric Strength | 11.0 kV/mm | 279 kV/in | Wet, short term. ASTM D149 |
Dissipation Factor | 0.020 @Frequency 1e+6 Hz |
0.020 @Frequency 1e+6 Hz |
Wet; ASTM D150 |
Arc Resistance | 175 sec | 175 sec | ASTM D495 |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Mold Temperature | 143 - 177 °C | 289 - 351 °F | compression/transfer molding. |
174 - 182 °C | 345 - 360 °F | injection molding. |