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Rogers Corporation Syron™ 7100 Thermoplastic Circuit Material

Category Polymer , Thermoplastic
Manufacturer Rogers Corporation
Trade Name Syron™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Rogers Corporation Syron™ 7100 Thermoplastic Circuit Material.pdf
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Material Notes:
SYRON™ 7100 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. SYRON 7100 is thermally stable, with a melt temperature higher than PTFE materials and an estimated relative thermal index (RTI) greater than 210°C. The SYRON products possess impressive chemical and radiation resistance.Features and Benefits:High maximum operating temperature - suitable for applications where high temperature stability is requiredExcellent chemical resistance - Ease of processing, Resistant to solvents and reagents used to process circuit boards, and Operates in harsh chemical environmentsEnvironmentally friendly - Halogen free/inherently flame retardant, Lead-free solder capable, low smoke/toxicity1/2 oz. (18 micron) very low profile electrodeposited copper foil claddingTypical Applications:Flex-to-install applicationsLightweight feed manifoldsAutomotive sensorsConformal circuitryOil and gas explorationAirborne lightning strike protectionInformation provided by Rogers Corporation.
Physical Properties Metric English Comments
Moisture Absorption at Equilibrium 0.050 %

@Thickness 0.0508 mm
 0.050 %

@Thickness 0.00200 in
 D24/23; IPC-TM-650 2.6.2.1
0.15 %

@Thickness 0.0508 mm
 0.15 %

@Thickness 0.00200 in
 D48/50; ASTM D570
0.21 %

@Thickness 0.102 mm
 0.21 %

@Thickness 0.00400 in
 D24/23; IPC-TM-650 2.6.2.1
0.32 %

@Thickness 0.102 mm
 0.32 %

@Thickness 0.00400 in
 D48/50; ASTM D570
Thickness 50.8 - 102 microns
2.00 - 4.00 mil
Mechanical Properties Metric English Comments
Tensile Strength 190 MPa

@Thickness 0.102 mm
 27600 psi

@Thickness 0.00400 in
 RT; ASTM D638
216 MPa

@Thickness 0.0508 mm
 31300 psi

@Thickness 0.00200 in
 RT; ASTM D638
Tensile Modulus 7.86 GPa

@Thickness 0.102 mm
 1140 ksi

@Thickness 0.00400 in
 RT; ASTM D638
11.5 GPa

@Thickness 0.0508 mm
 1670 ksi

@Thickness 0.00200 in
 RT; ASTM D638
Peel Strength 1.09 kN/m

@Thickness 0.0508 mm
 6.20 pli

@Thickness 0.00200 in
 IPC-TM-650 2.4.8
1.10 kN/m

@Thickness 0.102 mm
 6.30 pli

@Thickness 0.00400 in
 IPC-TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 16.5 µm/m-°C

@Thickness 0.0508 mm,
Temperature 0.000 - 150 °C
 9.17 µin/in-°F

@Thickness 0.00200 in,
Temperature 32.0 - 302 °F
 X-Direction; IPC-TM-650 2.1.41
18.0 µm/m-°C

@Thickness 0.0508 mm,
Temperature 0.000 - 150 °C
 10.0 µin/in-°F

@Thickness 0.00200 in,
Temperature 32.0 - 302 °F
 Y-Direction; IPC-TM-650 2.1.41
19.0 µm/m-°C

@Thickness 0.102 mm,
Temperature 0.000 - 150 °C
 10.6 µin/in-°F

@Thickness 0.00400 in,
Temperature 32.0 - 302 °F
 X-Direction; IPC-TM-650 2.1.41
21.0 µm/m-°C

@Thickness 0.102 mm,
Temperature 0.000 - 150 °C
 11.7 µin/in-°F

@Thickness 0.00400 in,
Temperature 32.0 - 302 °F
 Y-Direction; IPC-TM-650 2.1.41
57.0 µm/m-°C

@Thickness 0.0508 mm,
Temperature 0.000 - 150 °C
 31.7 µin/in-°F

@Thickness 0.00200 in,
Temperature 32.0 - 302 °F
 Z-Direction; IPC-TM-650 2.1.41
76.0 µm/m-°C

@Thickness 0.102 mm,
Temperature 0.000 - 150 °C
 42.2 µin/in-°F

@Thickness 0.00400 in,
Temperature 32.0 - 302 °F
 Z-Direction; IPC-TM-650 2.1.41
Thermal Conductivity 0.300 W/m-K
2.08 BTU-in/hr-ft²-°F
ASTM C518
Maximum Service Temperature, Air >= 210 °C
>= 410 °F
pending UL RTI
Glass Transition Temp, Tg 172 °C

@Thickness <=0.0508 mm
 342 °F

@Thickness <=0.00200 in
 TMA; ASTM D3850
176 °C

@Thickness <=0.102 mm
 349 °F

@Thickness <=0.00400 in
 TMA; ASTM D3850
Flammability, UL94 V-0

@Thickness 0.0508 mm
 V-0

@Thickness 0.00200 in
 pending
V-0

@Thickness 0.102 mm
 V-0

@Thickness 0.00400 in
 pending
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+16 ohm-cm

@Thickness 0.102 mm
 1.00e+16 ohm-cm

@Thickness 0.00400 in
 Condition A; IPC 2.5.17.1
Surface Resistance 1.00e+12 ohm

@Thickness 0.102 mm
 1.00e+12 ohm

@Thickness 0.00400 in
 Condition A; IPC 2.5.17.1
Dielectric Constant <= 3.39

@Thickness 0.102 mm,
Frequency 1.00e+10 Hz
 <= 3.39

@Thickness 0.00400 in,
Frequency 1.00e+10 Hz
 Z direction; IPC-TM-650 2.5.5.5
<= 3.61

@Thickness 0.0508 mm,
Frequency 1.00e+10 Hz
 <= 3.61

@Thickness 0.00200 in,
Frequency 1.00e+10 Hz
 Z direction; IPC-TM-650 2.5.5.5
Dielectric Strength 89.4 kV/mm

@Thickness 0.102 mm
 2270 kV/in

@Thickness 0.00402 in
 Z Direction; IPC-TM-650 2.5.6.2
102 kV/mm

@Thickness 0.0508 mm
 2580 kV/in

@Thickness 0.00200 in
 Z Direction; IPC-TM-650 2.5.6.2
Dissipation Factor <= 0.0050

@Frequency 1.00e+10 Hz
 <= 0.0050

@Frequency 1.00e+10 Hz
 Z direction; IPC-TM-650 2.5.5.5.1
<= 0.0060

@Frequency 1.00e+10 Hz
 <= 0.0060

@Frequency 1.00e+10 Hz
 Z direction; IPC-TM-650 2.5.5.5.1
Descriptive Properties Value Comments
Dimensional Stability -0.01 mm/m
Y-CMD; IPC-TM-650, 2.4.39A; 150°C bake; 0.004"
-0.025 mm/m
X-MD; IPC-TM-650, 2.4.39A; 150°C bake; 0.004"
0.03 mm/m
X-MD; IPC-TM-650, 2.4.39A; 150°C bake; 0.002"
0.037 mm/m
Y-CMD; IPC-TM-650, 2.4.39A; 150°C bake; 0.002"
T260 pass
Thermal Coefficient of Dielectric Constant 9 ppm/°C
IPC-TM-650 2.5.5.5; -100°C to 250°C; Z-Direction
Time to Delamination (T-288) pass
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