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Premix Thermoplastics PREBOARD E1026 Standard Epoxy Circuit Boards

Category Polymer , Thermoset , Epoxy
Manufacturer Premix Thermoplastics Inc.
Trade Name PREBOARD
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Premix Thermoplastics PREBOARD E1026 Standard Epoxy Circuit Boards.pdf
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Material Notes:
PREBOARD is a thermoplastic based PCB laminate. Low dissipation factor leads to high gain in the antennas. As a non filled laminate PREBOARD is fully homogenous so that consistant properties are achieved through the whole panel even at high frequencies. Temperature stability in processing and long term stability in service at elevated temperatures are good. It also has low moisture absorption. PREBOARD is offered as custom sized panels according to customer specifications. Also thin films made of the same material are available and marketed under the name PREFLEX. Thus the same material can also be used in rigid/flex boards. The material lends itself also well for injection moulding and is available for that purpose in granules sold under the name PREPERM. This enables the production of 3D circuit boards to customer specification. Normally low temperature solders are recommended. Soldering with standard non lead solders has been demonstrated with fixtures.Key features:Low and stable dissipation factor Low and stable dielectric constantLow water absorptionHigh TgRecyclable and RoHS compliantEasier to process than PTFEGood thermal resistanceLow CTE in all directionsFlame retardant UL 94-V0Applications: cellular phone base stations, cell phone antenna frames and similar antennas and other RF and microwave devices. Also halogen free flame retardant UL-V0 grade is available.Information from Premix OY
Physical Properties Metric English Comments
Density 1.06 g/cc
0.0383 lb/in³
ASTM D792
Water Absorption 0.40 %
0.40 %
TM650 2.6.2.1
Mechanical Properties Metric English Comments
Tensile Strength 55.0 MPa
7980 psi
ISO 527
Tensile Modulus 2.30 GPa
334 ksi
ISO 527
Flexural Modulus 2.20 GPa
319 ksi
ISO 178
Thermal Properties Metric English Comments
CTE, linear 50.0 µm/m-°C
27.8 µin/in-°F
Heat Distortion Temperature 195 °C
383 °F
Glass Transition Temp, Tg 197 °C
387 °F
TM650 2.4.25
210 °C
410 °F
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 2.00e+8 ohm-cm
2.00e+8 ohm-cm
TM650 2.5.17.1
Surface Resistance 2.00e+8 ohm
2.00e+8 ohm
TM650 2.5.17.1
Dielectric Constant 2.6

@Frequency 1.00e+9 - 1.00e+10 Hz
2.6

@Frequency 1.00e+9 - 1.00e+10 Hz
TM650 2.5.5.9
Dissipation Factor 0.0020

@Frequency 1.00e+9 - 1.00e+10 Hz
0.0020

@Frequency 1.00e+9 - 1.00e+10 Hz
Descriptive Properties Value Comments
Copper Peel Strength (N/mm) 1
IPE-TM650 2.4.8
Dimensional Stability (%) <0.2
150°C/2h
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