Parker Chomerics Tecknit Teckfip™ HC FIP-E Formed in Place Conductive Elastomer

Category	Polymer , Thermoset , Rubber or Thermoset Elastomer (TSE)
Manufacturer	Parker Chomerics Tecknit
Trade Name	Teckfip™
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics Tecknit Teckfip™ HC FIP-E Formed in Place Conductive Elastomer.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Heat cure compound. Commercial grade FIP compound designed for moderate shielding performance. The Ag/glass particles are very smooth which leads to very low compression set value.Information provided by Chomerics

Physical Properties	Metric	English	Comments
Specific Gravity	1.53 - 2.07 g/cc	1.53 - 2.07 g/cc

Mechanical Properties	Metric	English
Hardness, Shore A	60 - 80	60 - 80
Tensile Strength	>= 1.38 MPa	>= 200 psi
Elongation at Break	>= 50 %	>= 50 %
Peel Strength	>= 9.00 kN/m	>= 51.4 pli
Compression Set	10 - 25 %	10 - 25 %
	23 % @Temperature 70.0 °C, Time 79200 sec	23 % @Temperature 158 °F, Time 22.0 hour

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	125 °C	257 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Electrical Properties	Metric	English
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm
Surface Resistance	<= 0.010 ohm	<= 0.010 ohm
	<= 0.030 ohm @Temperature 85.0 °C, Time 605000 sec	<= 0.030 ohm @Temperature 185 °F, Time 168 hour

Processing Properties	Metric	English	Comments
Cure Time	60.0 min @Temperature 125 °C	1.00 hour @Temperature 257 °F
Shelf Life	1.00 Month	1.00 Month	Syringe
	6.00 Month	6.00 Month	Cartridge

Descriptive Properties	Value	Comments
Color	Ivory
Filler	Silver/Glass

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