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Parker Chomerics CHO-SEAL® S6600 Conductive Elastomer
| Category | Polymer , Thermoset , Rubber or Thermoset Elastomer (TSE) , Silicone |
| Manufacturer | Parker Chomerics |
| Trade Name | CHO-SEAL® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Parker Chomerics CHO-SEAL® S6600 Conductive Elastomer.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Description: Low-end shielding and ESD protection; high tensile strength; no corrosion or fluid resistance.Molded onlyRoHS CompliantInformation provided by Chomerics
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 0.950 - 1.45 g/cc | 0.950 - 1.45 g/cc | ASTM D792 |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore A | 68 - 82 | 68 - 82 | ASTM D2240 |
| Tensile Strength | >= 4.48 MPa | >= 650 psi | ASTM D412 |
| Elongation at Break | >= 70 % | >= 70 % | ASTM D412 |
| Compression Set | <= 45 % @Temperature 100 °C, Time 252000 sec |
<= 45 % @Temperature 212 °F, Time 70.0 hour |
ASTM D395, Method B |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Thermal Conductivity | 0.600 W/m-K @Pressure 2.07 MPa |
4.16 BTU-in/hr-ft²-°F @Pressure 300 psi |
ASTM D5470 |
| Maximum Service Temperature, Air | 200 °C | 392 °F | |
| Minimum Service Temperature, Air | -45.0 °C | -49.0 °F | Flex TR10 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 7.0 ohm-cm | <= 7.0 ohm-cm | without pressure-sensitive adhesive; CEPS-0002 |
| Shielding Effectiveness | >= 50 dB @Frequency 1.00e+10 Hz |
>= 50 dB @Frequency 1.00e+10 Hz |
Plane Wave; Method 1, CHO-TM-TP08 |
| >= 60 dB @Frequency 2.00e+9 Hz |
>= 60 dB @Frequency 2.00e+9 Hz |
Plane Wave; Method 1, CHO-TM-TP08 | |
| >= 80 dB @Frequency 1.00e+8 Hz |
>= 80 dB @Frequency 1.00e+8 Hz |
E-Field; Method 1, CHO-TM-TP08 | |
| >= 80 dB @Frequency 5.00e+8 Hz |
>= 80 dB @Frequency 5.00e+8 Hz |
E-Field; Method 1, CHO-TM-TP08 |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Binder | Silicone | |
| Filler | Carbon | |
| Heat Aging | <7 ohm-cm | 150°C for 48 hr, CEPS-0002 |
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