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Parker Chomerics CHO-BOND 1067 Splicing Compound Kit
| Category | Other Engineering Material , Additive/Filler for Polymer |
| Manufacturer | Parker Chomerics |
| Trade Name | CHO-BOND |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Parker Chomerics CHO-BOND 1067 Splicing Compound Kit.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Information provided by Chomerics
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | >= 2.00 g/cc | >= 2.00 g/cc | |
| Solubility in Water | 0.00 % | 0.00 % | Insoluble |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Aluminum, Al | >= 70 % | >= 70 % | |
| Silver, Ag | <= 30 % | <= 30 % |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Silver | |
| Physical Form | Silver Powder |
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