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Parker Chomerics CHO-BOND 1024 Conductive Silicone Splicing Compound

Category Polymer , Adhesive , Thermoset
Manufacturer Parker Chomerics
Trade Name CHO-BOND
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-BOND 1024 Conductive Silicone Splicing Compound.pdf
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Material Notes:
Conductive splicing compounds are intended for making "custom" EMI/RFI gaskets from standard CHO-SEAL® and CHO-SIL® strips. Compounds consist of Chomerics silver-bearing powders dispersed in silicone binder. Applications: THERMATTACH have been designed to provide a high performance bond in the assembly of EBGA and TBGA semiconductor packages. Their thermally conductive filler ensures superior package performance when used to bond the flex or laminate substrate to stiffeners and heat spreaders.Information provided by Chomerics
Physical Properties Metric English Comments
Density 3.20 g/cc
0.116 lb/in³
Solubility in Water 0.00 %
0.00 %
Insoluble
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 125 °C
257 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Processing Properties Metric English Comments
Pot Life 30 min

@Temperature 24.0 °C
30 min

@Temperature 75.2 °F
20160 min

@Temperature -35.0 °C
20160 min

@Temperature -31.0 °F
Shelf Life 6.00 Month
6.00 Month
Parts A & B
Descriptive Properties Value Comments
Part A/B/C % 23/3.5/73.5
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