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Lord Adhesives Thermosetâ„¢ SC-102 Unfilled Silicone Encapsulant

Category Polymer , Thermoset , Silicone , Silicone, RTV, Encapsulation Grade
Manufacturer Lord Adhesives
Trade Name Thermoset™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Lord Adhesives Thermosetâ„¢ SC-102 Unfilled Silicone Encapsulant.pdf
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Material Notes:
Lord SC-102 is a "water-white" clear, two component, silicone encapsulating system. It has a very low viscosity and, when cured, a low Shore A hardness. Lord SC-102 is optically transparent with no yellowish tint. It offers excellent protection for delicate components against vibration, mechanical and thermal shock, and moisture while producing a soft, tack-free surface. This material was formulated for use in electrical and electronic potting applications where ease of repair is a necessity. Lord SC-102 can be easily cut open with a knife.Lord SC-102 is addition curing. It will not depolymerize when heated in confined spaces as do many condensation curing silicones. As with all silicones, SC-102 generates no exotherm as it cures. It also exhibits low shrinkage and stress on components as it cures. Lord SC-102's cure may be accelerated with elevated temperature.All information provided by Lord.
Physical Properties Metric English Comments
Specific Gravity 0.970 g/cc
0.970 g/cc
STM 2
Viscosity 380 cP
380 cP
STM 1
Mechanical Properties Metric English Comments
Hardness, Shore A 26
26
ASTM D2240
Thermal Properties Metric English Comments
CTE, linear 480 µm/m-°C
267 µin/in-°F
Calculated from Volume CTE; ASTM D864
Thermal Conductivity 0.146 W/m-K
1.01 BTU-in/hr-ft²-°F
ASTM D2214
Maximum Service Temperature, Air 200 °C
392 °F
Optical Properties Metric English Comments
Transmission, Visible 90 %
90 %
transparent; thickness not quantified
Electrical Properties Metric English Comments
Volume Resistivity 2.50e+15 ohm-cm

@Temperature 25.0 °C
2.50e+15 ohm-cm

@Temperature 77.0 °F
ASTM D257
Dielectric Constant 2.96

@Frequency 1.00e+6 Hz,
Temperature 25.0 °C
2.96

@Frequency 1.00e+6 Hz,
Temperature 77.0 °F
ASTM D150
Dielectric Strength 17.3 kV/mm
440 kV/in
ASTM D149
Dissipation Factor 0.0028

@Frequency 1.00e+6 Hz,
Temperature 25.0 °C
0.0028

@Frequency 1.00e+6 Hz,
Temperature 77.0 °F
ASTM D150
Processing Properties Metric English Comments
Cure Time 8.00 - 10.0 min

@Temperature 100 °C
0.133 - 0.167 hour

@Temperature 212 °F
15.0 - 20.0 min

@Temperature 60.0 °C
0.250 - 0.333 hour

@Temperature 140 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 30 - 40 min

@Temperature 25.0 °C
30 - 40 min

@Temperature 77.0 °F
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Appearance Clear
Mix Ratio 1:1
by weight, by volume
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