- HOME
- POLYMER SEARCH
- Thermoset
- Epoxy
- Epoxy Encapsulant, Unreinforced
- Lord Adhesives Circalokâ„¢ 6009 A/B Flame Retardant Epoxy Encapsulant
Lord Adhesives Circalokâ„¢ 6009 A/B Flame Retardant Epoxy Encapsulant
| Category | Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced |
| Manufacturer | Lord Adhesives |
| Trade Name | Circalok™ |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Lord Adhesives Circalokâ„¢ 6009 A/B Flame Retardant Epoxy Encapsulant.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Circalokâ„¢ 6009 A/B is a two component epoxy resin system which has moderate thermal conductivity and low viscosity. Circalokâ„¢ 6009 A/B meets UL 94V-0 specification for flame retardance.All information provided by Lord.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.00 g/cc | 1.00 g/cc | Part B |
| 1.52 g/cc | 1.52 g/cc | Mixed | |
| 1.65 g/cc | 1.65 g/cc | Part A | |
| Water Absorption | 0.35 % @Temperature 25.0 °C, Time 864000 sec |
0.35 % @Temperature 77.0 °F, Time 240 hour |
|
| Viscosity | 40 cP @Temperature 25.0 °C |
40 cP @Temperature 77.0 °F |
Part B |
| 2600 cP @Temperature 25.0 °C |
2600 cP @Temperature 77.0 °F |
Mixed | |
| 16600 cP @Temperature 25.0 °C |
16600 cP @Temperature 77.0 °F |
Part A | |
| Linear Mold Shrinkage | 0.0040 cm/cm | 0.0040 in/in |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 90 | 90 | |
| Tensile Strength, Yield | 48.3 MPa | 7000 psi | |
| Elongation at Yield | 1.9 % | 1.9 % |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 130 °C | 266 °F | |
| Flammability, UL94 | V-0 | V-0 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+15 ohm-cm @Temperature 25.0 °C |
1.00e+15 ohm-cm @Temperature 77.0 °F |
|
| Dielectric Strength | 19.7 kV/mm | 500 kV/in |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
|
| Gel Time | 15.0 - 30.0 min @Temperature 65.0 °C |
15.0 - 30.0 min @Temperature 149 °F |
|
| Shelf Life | 12.0 Month | 12.0 Month |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Appearance | Black | Part A |
| Black | Mixed | |
| Pale Yellow | Part B | |
| Mix Ratio | 100:10 | by weight |
| 100:16.5 | by volume |
Users viewing this material also viewed the following:
- H.C. Starck MoMP 4.5 - 5.5 micron Molybdenum Metal Powder, Mo (99.95%)
- LATI Latan 13 S/20 POM, 20% Glass Bead Reinforced
- Sekisui PIOCELAN OP-15D Moldable Polymer Foam
- Teknor Apex Beetle® PET166F Polyethylene Terephthalate, 30% Glass Fiber Reinforced
- A. Schulman PP 3466-01 Polypropylene Homopolymer Polypropylene
- ExxonMobil SAE 40 Mobilgard M50
- ChevronTexaco Aviation A Hydraulic Fluid
- 3M Dyneon™ FC 2230 Fluoroelastomer
- BASF Sicotan® Yellow K 1011 Color Additive
Copyright © lookpolymers.com All Rights Reserved