Hexion Bakelite™ X24 Phenolic Formaldehyde Resin (discontinued **)

Category	Polymer , Thermoset , Filled/Reinforced Thermoset , Phenolic
Manufacturer
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Hexion Bakelite™ X24 Phenolic Formaldehyde Resin (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005.

Physical Properties	Metric	English	Comments
Density	1.43 g/cc	0.0517 lb/in³	ISO 1183
Apparent Bulk Density	0.600 g/cc	0.0217 lb/in³	ISO 60
Linear Mold Shrinkage, Flow	0.0060 cm/cm	0.0060 in/in	Compression molding; ISO 2577
	0.0065 cm/cm	0.0065 in/in	Injection molding; ISO 2577

Mechanical Properties	Metric	English	Comments
Ball Indentation Hardness	275 MPa	39900 psi	H 961/30; ISO 2039/P1
Tensile Strength at Break	55.0 MPa	7980 psi	5 mm/min; ISO 527 - 1/2
Tensile Modulus	8.00 GPa	1160 ksi	1 mm/min; ISO 527 - 1/2
Flexural Strength	95.0 MPa	13800 psi	2 mm/min; ISO 178
Flexural Modulus	7.00 GPa	1020 ksi	ISO 178
Compressive Strength	250 MPa	36300 psi	Test specimen flat tested; ISO 604
Charpy Impact Unnotched	0.650 J/cm² @Temperature 23.0 °C	3.09 ft-lb/in² @Temperature 73.4 °F	ISO 179-1/2 eU
Charpy Impact, Notched	0.150 J/cm² @Temperature 23.0 °C	0.714 ft-lb/in² @Temperature 73.4 °F	ISO 179-1/2 eA

Thermal Properties	Metric	English	Comments
Deflection Temperature at 8.0 MPa	105 °C	221 °F	ISO 75-2
Shrinkage	0.350 % @Temperature 110 °C	0.350 % @Temperature 230 °F	Compression molding; ISO 2577
	0.550 % @Temperature 110 °C, Time 605000 sec	0.550 % @Temperature 230 °F, Time 168 hour	Injection molding; ISO 2577

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+11 ohm-cm	1.00e+11 ohm-cm	IEC 60093
Surface Resistance	1.00e+10 ohm	1.00e+10 ohm	IEC 60093
Dielectric Constant	14 @Frequency 100 Hz	14 @Frequency 100 Hz	IEC 60250
Dielectric Strength	15.0 kV/mm @Thickness 1.00 mm	381 kV/in @Thickness 0.0394 in	IEC 60243-P1
Dissipation Factor	0.22 @Frequency 100 Hz	0.22 @Frequency 100 Hz	IEC 60250
Comparative Tracking Index	125 V	125 V	Test liquid A; IEC 60112

Processing Properties	Metric	English	Comments
Feed Temperature	60.0 - 75.0 °C	140 - 167 °F	Injection molding
Nozzle Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Mold Temperature	160 - 190 °C	320 - 374 °F	Injection molding
	160 - 190 °C	320 - 374 °F	Compression molding
Injection Pressure	>= 15.0 MPa	>= 2180 psi	Compression and injection cavity mold pressure
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding

Descriptive Properties	Value	Comments
Chromatic Spectrum	Subdued Colors
Creep Rupture Strength	Good
Holding Pressure	Approximately 40-60% of injection pressure
Media Resistance	Good
Moisture Absorption	110 mg	ISO 62, 24 hours at 23°C
Reserves by Peak Temperature	High
Thermal Expansion	Slight

Users viewing this material also viewed the following: