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Epoxy Technology EPO-TEK® B9021 Epoxy Paste

Category	Polymer , Thermoset , Epoxy
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® B9021 Epoxy Paste.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. It can be used as the main gasket seal of glass plates in LCDs or sealing filter windows onto opto-sensors.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	1.35 g/cc	1.35 g/cc
Particle Size	<= 20 µm	<= 20 µm
Viscosity	4000 - 8000 cP @Temperature 23.0 °C	4000 - 8000 cP @Temperature 73.4 °F	50 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	76	76
Tensile Modulus	1.58 GPa	230 ksi	Storage
Shear Strength	6.80 MPa	986 psi	Lap
	9.38 MPa	1360 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	36.0 µm/m-°C	20.0 µin/in-°F	Below Tg
	57.0 µm/m-°C	31.7 µin/in-°F	Above Tg
Maximum Service Temperature, Air	160 °C	320 °F	Continuous
	260 °C	500 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 60.0 °C	>= 140 °F
Decomposition Temperature	313 °C	595 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Dry Time	<= 24.0 hour	<= 24.0 hour
Cure Time	30.0 min @Temperature 75.0 °C	0.500 hour @Temperature 167 °F	minimum, B-stage
Pot Life	40320 min	40320 min
Shelf Life	12.0 Month	12.0 Month	refrigerated

Descriptive Properties	Value	Comments
Color	White	before cure
Consistency	Smooth paste
Number of Components	Single
Weight Loss	3.77%	200°C
	4.41%	250°C
	7.97%	300°C

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