Cookson Group Plaskon® ULS-12HLG Epoxy Encapsulant (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® ULS-12HLG Epoxy Encapsulant (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.A state-of-the-art, ultra low stress epoxy encapsulant designed for packaging large, stress-sensitive DIPs, PLCCs and QFPs. It is formulated with a unique filler system that reduces the expansion coefficient without compromising moldability. Ultra low stress properties; Outstanding moldability (good mold filling, low wire sweep, fast cycles and good hot hardness); Superior reliability

Physical Properties	Metric	English	Comments
Density	1.88 g/cc	0.0679 lb/in³
Water Absorption	0.0034 %	0.0034 %
Viscosity	8500 cP @Temperature 175 °C	8500 cP @Temperature 347 °F	Automatic orifice Viscosity
Linear Mold Shrinkage	0.0025 cm/cm	0.0025 in/in
Spiral Flow	95.0 cm	37.4 in

Mechanical Properties	Metric	English
Hardness, Shore D	60	60
Flexural Strength	121 MPa	17500 psi
Flexural Modulus	14.0 GPa	2030 ksi

Thermal Properties	Metric	English
CTE, linear	12.5 µm/m-°C @Temperature 20.0 °C	6.94 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	65.0 µm/m-°C @Temperature 20.0 °C	36.1 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	166 °C	331 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Electrical Properties	Metric	English
Dielectric Constant	3.8 @Frequency 1000 Hz	3.8 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm	406 kV/in
Dissipation Factor	0.0020 @Frequency 1000 Hz	0.0020 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec

Processing Properties	Metric	English	Comments
Processing Temperature	170 - 185 °C	338 - 365 °F	Molding temperature

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