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Cookson Group Plaskon® SMT-B-1™ Epoxy Molding Compound for PBGAs  (discontinued **)

Category Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Manufacturer
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cookson Group Plaskon® SMT-B-1™ Epoxy Molding Compound for PBGAs  (discontinued **).pdf
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Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for grid arrays (BGA/LGA). It is formulated with a unique resin system that minimizes warpage and enables trouble-free molding onto laminated substrates. Minimal warpage (after post bake and solder treatment); Outstanding high temperature flexural strength; Low stress; Excellent moldability (low viscosity)
Physical Properties Metric English Comments
Density 1.88 g/cc
0.0679 lb/in³
Viscosity 8800 cP

@Temperature 175 °C
8800 cP

@Temperature 347 °F
Shimadzu Viscosity, 1000 psi
Spiral Flow 77.0 cm
30.3 in
175°C/1000 psi
Mechanical Properties Metric English Comments
Hardness, Shore D 73
73
Flexural Strength 72.0 MPa
10400 psi
Flexural Modulus 14.0 GPa
2030 ksi
Thermal Properties Metric English Comments
CTE, linear 14.0 µm/m-°C

@Temperature 20.0 °C
7.78 µin/in-°F

@Temperature 68.0 °F
CTE, linear, Transverse to Flow 58.0 µm/m-°C

@Temperature 20.0 °C
32.2 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K
4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 225 °C
437 °F
Flammability, UL94 V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
Electrical Properties Metric English Comments
Electrical Resistivity >= 1.00e+15 ohm-cm
>= 1.00e+15 ohm-cm
Dielectric Constant 4.0

@Frequency 1000 Hz
4.0

@Frequency 1000 Hz
Dielectric Strength >= 16.0 kV/mm
>= 406 kV/in
Processing Properties Metric English Comments
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
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