Cookson Group Plaskon® SMT-B-1™ Epoxy Molding Compound for PBGAs (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Manufacturer
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® SMT-B-1™ Epoxy Molding Compound for PBGAs (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for grid arrays (BGA/LGA). It is formulated with a unique resin system that minimizes warpage and enables trouble-free molding onto laminated substrates. Minimal warpage (after post bake and solder treatment); Outstanding high temperature flexural strength; Low stress; Excellent moldability (low viscosity)

Physical Properties	Metric	English	Comments
Density	1.88 g/cc	0.0679 lb/in³
Viscosity	8800 cP @Temperature 175 °C	8800 cP @Temperature 347 °F	Shimadzu Viscosity, 1000 psi
Spiral Flow	77.0 cm	30.3 in	175°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	73	73
Flexural Strength	72.0 MPa	10400 psi
Flexural Modulus	14.0 GPa	2030 ksi

Thermal Properties	Metric	English
CTE, linear	14.0 µm/m-°C @Temperature 20.0 °C	7.78 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	58.0 µm/m-°C @Temperature 20.0 °C	32.2 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	225 °C	437 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Electrical Properties	Metric	English
Electrical Resistivity	>= 1.00e+15 ohm-cm	>= 1.00e+15 ohm-cm
Dielectric Constant	4.0 @Frequency 1000 Hz	4.0 @Frequency 1000 Hz
Dielectric Strength	>= 16.0 kV/mm	>= 406 kV/in

Processing Properties	Metric	English	Comments
Processing Temperature	170 - 185 °C	338 - 365 °F	Molding temperature

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