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Cookson Group Plaskon® S-7P Epoxy Encapsulant  (discontinued **)

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cookson Group Plaskon® S-7P Epoxy Encapsulant  (discontinued **).pdf
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Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically formulated to provide a lower viscosity for those low stress applications where wire sweep may be a concern. Excellent low stress properties; Consistent moldability (low viscosity, easy of mold filling, fast cycles and good hot hardness); Outstanding cosmetics and markability; Superior reliability
Physical Properties Metric English Comments
Density 1.82 g/cc
0.0658 lb/in³
Viscosity 8500 cP

@Temperature 175 °C
8500 cP

@Temperature 347 °F
Automatic orifice Viscosity
Linear Mold Shrinkage 0.0037 cm/cm
0.0037 in/in
Spiral Flow 100 - 130 cm
39.4 - 51.2 in
177°C/1000 psi
Mechanical Properties Metric English Comments
Hardness, Shore D 73
73
Tensile Strength, Ultimate 62.0 MPa
8990 psi
Flexural Strength 103 MPa
14900 psi
Flexural Modulus 13.0 GPa
1890 ksi
Thermal Properties Metric English Comments
CTE, linear 18.0 µm/m-°C

@Temperature 20.0 °C
10.0 µin/in-°F

@Temperature 68.0 °F
CTE, linear, Transverse to Flow 45.0 µm/m-°C

@Temperature 20.0 °C
25.0 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K
4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 150 °C
302 °F
Flammability, UL94 V-0

@Thickness 1.60 mm
V-0

@Thickness 0.0630 in
V-0

@Thickness 1.60 mm
V-0

@Thickness 0.0630 in
Electrical Properties Metric English Comments
Dielectric Constant 3.8

@Frequency 1000 Hz
3.8

@Frequency 1000 Hz
Dielectric Strength 16.0 kV/mm
406 kV/in
Dissipation Factor 0.0020

@Frequency 1000 Hz
0.0020

@Frequency 1000 Hz
Arc Resistance 180 sec
180 sec
Processing Properties Metric English Comments
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
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