Polymer Property : Density = 0.0650 lb/in³ Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Density	1.80 g/cc	0.0650 lb/in³
3M Dyneon™ Fluorel™ FE-5610Q Fluoroelastomer VF2 + HFP Dipolymer (discontinued **) Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. The FE series O-ring grades are the c..
Density	1.80 g/cc	0.0650 lb/in³
3M Dyneon™ Fluorel™ FC-2174 Fluoroelastomer VF2 + HFP Dipolymer (discontinued **) Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. Excellent processability. Suggested ..
Density	1.80 g/cc	0.0650 lb/in³
3M Dyneon™ Fluorel™ FC-2152 Fluoroelastomer VF2 + HFP Dipolymer (discontinued **) Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. Improved hot tear over FC-2176. Sugg..
Density	1.80 g/cc	0.0650 lb/in³
3M Dyneon™ Fluorel™ FC-2177 Fluoroelastomer VF2 + HFP Dipolymer (discontinued **) Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. Slower cure rate and high tear streng..
Density	1.80 g/cc	0.0650 lb/in³
3M Dyneon™ Fluorel™ FC-2181 Fluoroelastomer VF2 + HFP Dipolymer (discontinued **) Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. Combines high elongation with excelle..
Density	1.80 g/cc	0.0650 lb/in³
Cookson Group Plaskon® 3400F Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs ..
Density	1.80 g/cc	0.0650 lb/in³	ISO 1183A
Chevron Phillips Xtel® XK2760BL Polyphenylene Sulfide Alloy (discontinued **) Xtel® XK2760BL is a high performance, glass fiber and mineral filled PPS based alloy developed to provide excellent mechanical strength with a unique blend of toughness, rigidity, and low flash cha..
Density	1.80 g/cc	0.0650 lb/inÂ³	ISO 1183
Menzolit MenzolitÂ® SMC 0800 Unsaturated Polyester UP SMC 0800 is a special SMC for applications within househould and kitchenware. The glass level has been selected to combine good mouldability with good strength and stiffness properties. The product ..
Density	1.80 g/cc	0.0650 lb/inÂ³	ASTM D572
Haysite 46000 Polyester SMC, 30% Glass Reinforced The 46000 series sheet molding compound is designed for "automotive type" applications requiring good mechanical properties and low shrink characteristics.
Density	1.80 g/cc	0.0650 lb/inÂ³
LATI Laramid CE/60 PPA, 60% Mineral Reinforced Semi-aromatic polyamide (PPA) based compound. Mineral filler. High dimensional stability. Good chemical resistance. Low moisture absorption.Availability: Africa & Middle East; Asia Pacific; Europe; ..
Density	1.80 g/cc	0.0650 lb/inÂ³	ISO 1183
SABIC Innovative Plastics LNP LUBRICOMP OFL38A PPS - Branched (Europe-Africa-Middle East) LNP* LUBRICOMP* OFL38A is a compound based on PPS - Branched resin containing Glass Fiber, PTFE. Added features include : Internally Lubricated.
Density	1.80 g/cc	0.0650 lb/inÂ³	Fiber Density
SGL Carbon Group SIGRAFIL CÂ® C25 P250 EPY Pelletized Carbon Fiber, Epoxy Sizing Milled SIGRAFIL C is excellent for making materials electrically conductive such as powders, dry mixtures, adhesives, floorings, aqueous adhesive systems and all aqueous mixing processes. Milled SIG..
Density	1.80 g/cc	0.0650 lb/inÂ³	Fiber Density
SGL Carbon Group SIGRAFIL CÂ® C25 S006 GLY Staple Carbon Fiber, Glycerine Sizing In its precision cut staple form SIGRAFIL C is a superior free-flowing material suitable for low and high temperature thermoplastic injection-molding processes. It is also an excellent way of making..
Density	1.80 g/cc	0.0650 lb/inÂ³	ISO 1183
Solvay Specialty Polymers AmodelÂ® FC -1160 Polyphthalamide (PPA), 60% Glass Fiber AmodelÂ® FC-1160 is an FDA-approved, 60% glass fiber reinforced resin designed for high strength and stiffness. This combines with its excellent thermal properties, low water absorption and good h..
Density	1.80 g/cc	0.0650 lb/inÂ³	Fiber Density
SGL Carbon Group SIGRAFIL CÂ® C25 M250 UNS Milled Carbon Fiber, Unsized Carbon Fiber Milled SIGRAFIL C is excellent for making materials electrically conductive such as powders, dry mixtures, adhesives, floorings, aqueous adhesive systems and all aqueous mixing processes. Milled SIG..
Density	1.80 g/cc	0.0650 lb/inÂ³	ASTM D792
Sumitomo Bakelite DurezÂ® 32245 Phenolic, Compression Grade Durez 32245 Black Phenolic is a two-stage glass fiber and mineral filled special purpose molding compound. It is especially designed for applications requiring high strength and dimensional stabilit..
Density	1.80 g/cc	0.0650 lb/in³
UCAR Carbon UCAR® SLX Extruded Graphite Densified prior to graphitization, Grade SLX is an extruded graphite with increased densities and strength over SL.Typical Applications:CZ silicon crystal growth Quartz processing Purified electroni..
Density	1.80 g/cc	0.0650 lb/in³	ASTM F1315
Thermoseal KLINGERSIL® C-4401 General Application Gasketing Synthetic FiberNitrile BinderExcellent SealabilityExcellent Chemical ResistanceGood Creep RelaxationGeneral Purpose SheetData for this material is available for download into ANSYS xml format: C4401..
Density	1.80 g/cc	0.0650 lb/in³	ASTM F1315
Thermoseal KLINGERSIL® C-6400 SBR Binder Gasketing Synthetic FiberModified SBR BinderGood Anti-Stick PropertiesGood Steam SheetInformation provided by Thermoseal Inc.
Density	1.80 g/cc	0.0650 lb/in³
Loctite® 3534 Glob Top Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp..
Density	1.80 g/cc	0.0650 lb/in³	Cured
Chesterton ARC SD4i High temperature ceramic reinforced erosion resistant coating Description: An advanced ceramic composite for resurfacing and protection of metal surfaces in immersion service. It is normally applied in a thickness range of 250-370 microns (10-15 mils) per coat..
Density	1.80 g/cc @Thickness >=0.000 mm	0.0650 lb/in³ @Thickness >=0.000 in	24hr/23°C/50% RH; ISO 1183-A; IEC/EN 61212-2 7.3
Elektro-Isola G-Etronax EP 11 Epoxy, Glass Fabric Reinforcement, Green, Tubes Description: Particularly good electrical and mechanical properties. Extremely high mechanical strength, even at high temperatures. Retains electrical properties at high air humidity. High resistanc..
Density	1.80 g/cc	0.0650 lb/in³
Cytec Thornel® P-100 Carbon Fiber/Epoxy Advanced Composite System Data provided by the manufacturer, Amoco Performance Products, Inc. Measured in proprietary aerospace grade epoxy formulations at 0.62 fiber content by volume.Thornel® products were sold by Amoco ..
Density	1.80 g/cc	0.0650 lb/in³
Advanced Ceramics ACL 2089 Cordierite Cordierite glass-ceramic has good thermal shock properties and is suitable for heat resistant components which undergo rapid thermal cycling.Information provided by Advanced Ceramics Limited (ACL)
Density	1.80 - 1.95 g/cc	0.0650 - 0.0704 lb/in³
Aremco Ceramabond™ 670 High Temperature Ceramic Adhesive/Paste, Alumina Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and..
Density	1.80 - 2.00 g/cc	0.0650 - 0.0723 lb/in³	ISO 1138
Bulk Molding Compounds tetra-DUR F 4401 Bulk Molding Compound UL-licensed, general purpose productTypical Applications - Requiring mechanical strength, abrasion resistance, dimensional stability, electrical insulation, electrostatic dissipation (explosion prot..