Cookson Group Plaskon® 1002 Conventional Encapsulant (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® 1002 Conventional Encapsulant (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, low stress, conventional molding compound recommended for high volume commodity-type packages that house simple linear and discrete devices. These packages include low lead count DIPs, TO-types, diodes and small SOICs. Excellent moldability (fast curing, minimal if any deflashing, no degreasing); Superior cosmetics and markability; Low stress

Physical Properties	Metric	English	Comments
Density	1.86 g/cc	0.0672 lb/in³
Viscosity	16500 cP @Temperature 175 °C	16500 cP @Temperature 347 °F	Automatic orifice Viscosity
Spiral Flow	63.0 - 87.0 cm	24.8 - 34.3 in	177°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	81	81
Flexural Strength	131 MPa	19000 psi
Flexural Modulus	17.0 GPa	2470 ksi

Thermal Properties	Metric	English
CTE, linear	18.0 µm/m-°C @Temperature 20.0 °C	10.0 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	56.0 µm/m-°C @Temperature 20.0 °C	31.1 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	153 °C	307 °F
Flammability, UL94	V-0 @Thickness 1.60 mm	V-0 @Thickness 0.0630 in
	V-0 @Thickness 1.60 mm	V-0 @Thickness 0.0630 in

Electrical Properties	Metric	English
Dielectric Constant	3.8 @Frequency 1000 Hz	3.8 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm	406 kV/in
Dissipation Factor	0.0020 @Frequency 1000 Hz	0.0020 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec

Processing Properties	Metric	English	Comments
Processing Temperature	170 - 185 °C	338 - 365 °F	Molding temperature

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