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- Cookson Group Plaskon® 1002 Conventional Encapsulant (discontinued **)
Cookson Group Plaskon® 1002 Conventional Encapsulant (discontinued **)
| Category | Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced |
| Manufacturer | |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Cookson Group Plaskon® 1002 Conventional Encapsulant
(discontinued **).pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, low stress, conventional molding compound recommended for high volume commodity-type packages that house simple linear and discrete devices. These packages include low lead count DIPs, TO-types, diodes and small SOICs. Excellent moldability (fast curing, minimal if any deflashing, no degreasing); Superior cosmetics and markability; Low stress
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.86 g/cc | 0.0672 lb/in³ | |
| Viscosity | 16500 cP @Temperature 175 °C |
16500 cP @Temperature 347 °F |
Automatic orifice Viscosity |
| Spiral Flow | 63.0 - 87.0 cm | 24.8 - 34.3 in | 177°C/1000 psi |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 81 | 81 | |
| Flexural Strength | 131 MPa | 19000 psi | |
| Flexural Modulus | 17.0 GPa | 2470 ksi |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 18.0 µm/m-°C @Temperature 20.0 °C |
10.0 µin/in-°F @Temperature 68.0 °F |
|
| CTE, linear, Transverse to Flow | 56.0 µm/m-°C @Temperature 20.0 °C |
31.1 µin/in-°F @Temperature 68.0 °F |
|
| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Glass Transition Temp, Tg | 153 °C | 307 °F | |
| Flammability, UL94 | V-0 @Thickness 1.60 mm |
V-0 @Thickness 0.0630 in |
|
| V-0 @Thickness 1.60 mm |
V-0 @Thickness 0.0630 in |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Dielectric Constant | 3.8 @Frequency 1000 Hz |
3.8 @Frequency 1000 Hz |
|
| Dielectric Strength | 16.0 kV/mm | 406 kV/in | |
| Dissipation Factor | 0.0020 @Frequency 1000 Hz |
0.0020 @Frequency 1000 Hz |
|
| Arc Resistance | 180 sec | 180 sec |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Processing Temperature | 170 - 185 °C | 338 - 365 °F | Molding temperature |
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