Polymer Property : Flexural Modulus = 2470 ksi Product List

Mechanical Properties

Tips: 30 items are displayed at most.

Mechanical Properties	Metric	English	Comments
Flexural Modulus	17.0 GPa	2470 ksi	ISO 178
PolyOne OnForce™ LFT NN-60LGF/000 HS Natural Polyamide 66 (Nylon 66) PolyOne's Long Fiber Thermoplastic (LFT) compounds are formulated for demanding applications which require high stiffness and good impact such as metal replacement or other structural applications. ..
Flexural Modulus	17.0 GPa	2470 ksi	ASTM D790
Chevron Phillips Ryton® R10 5004A PPS Polyphenylene Sulfide  (discontinued **) Ryton® PPS is used in many electronic and automotive applications because of its high strength, favorable electrical properties, and high temperature stability.Data provided by the manufacturer.Sol..
Flexural Modulus	17.0 GPa	2470 ksi	ISO 178
Victrex® WG102™ Polyaryletherketone Product Description: High performance thermoplastic material, PolyArylEtherKetone (PAEK), semi crystalline, granules for injection moulding, standard flow, FDA food contact compliantWG102 does not c..
Flexural Modulus	17.0 GPa	2470 ksi
Cookson Group Plaskon® 1002 Conventional Encapsulant  (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, low stress, conventional molding compound recommended for high volume commodity-type packages that house simple linea..
Flexural Modulus	17.0 GPa	2470 ksi
Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound  (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A flame retardant, novolac-hardened epoxy molding compound recommended for semiconductor packages that are not stress sensitive.
Flexural Modulus	17.0 GPa	2470 ksi
Cookson Group Plaskon® AMC2 (132.203) Epoxy Molding Compound  (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound specifically formulated for packaging stress-sensitive devices in DIPs, SOICs, PLCCs and small QFPs. F..
Flexural Modulus	17.0 GPa	2470 ksi	ISO 178
Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures  (disconti Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application ..
Flexural Modulus	17.0 GPa	2470 ksi	ISO 178
Solvay Specialty Polymers Ryton® R-7-120NA Polyphenylene Sulfide Compound  (Unverified Data**) Natural Color Polyphenylene Sulfide CompoundRyton® R-7-120NA is an advanced glass/mineral filled polyphenylene sulfide compound developed to provide good weldline strength and low maintenance moldi..
Flexural Modulus	17.0 GPa	2470 ksi	ISO 178
Solvay Specialty Polymers Ryton® R-7-120BL Polyphenylene Sulfide Compound  (Unverified Data**) Black Polyphenylene Sulfide CompoundRyton® R-7-120BL is an advanced glass/mineral filled polyphenylene sulfide compound developed to provide good weldline strength and low maintenance molding using..
Flexural Modulus	17.0 GPa	2470 ksi
Lehmann & Voss LUVOCOMÂ® 1-7532 Polyamide 66, with carbon fiber Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp..
Flexural Modulus	17.0 GPa	2470 ksi
Lehmann & Voss LUVOCOMÂ® 19-7900 Polyamide 46, with carbon fiber and PTFE Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp..
Flexural Modulus	17.0 GPa	2470 ksi
Lehmann & Voss LUVOCOMÂ® 1/XCF/20 Polyamide 66, with carbon fiber, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp..
Flexural Modulus	17.0 GPa	2470 ksi
Lehmann & Voss LUVOCOMÂ® 1850-7581 PBT, with carbon fiber and PTFE Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Electrically conductive, suitable for continuous discharging of statically generated electricit..
Flexural Modulus	17.0 GPa	2470 ksi	2 mm/min; ISO 178
SABIC Innovative Plastics LNP LUBRICOMP JCL36 PES (Europe-Africa-Middle East) LNP* LUBRICOMP* JCL36 is a compound based on Polyethersulfone resin containing Carbon Fiber, PTFE. Added features include : Internally Lubricated, Electrically Conductive.
Flexural Modulus	17.0 GPa	2470 ksi	ISO 178
Solvay Specialty Polymers IxefÂ® 1025 Polyarylamide (PARA), 50% Glass Fiber IxefÂ® 1025 is a 50% glass-fiber reinforced, UV stabilized polyarylamide which exhibits very high strength and rigidity, outstanding surface gloss, and excellent creep resistance.Features: Good Ch..
Flexural Modulus	17.0 GPa	2470 ksi	2 mm/min; ISO 178
SABIC Innovative Plastics LNP THERMOCOMP LC006 PEEK (Europe-Africa-Middle East) LNP* THERMOCOMP* LC006 is a compound based on Polyetheretherketone containing Carbon Fiber. Added features include: Electrically Conductive.
Flexural Modulus	17.0 GPa	2470 ksi	ISO 178
SABIC Innovative Plastics LNP THERMOCOMP WC006 Polyester, TP (Asia Pacific) LNP* Thermocomp* WC006 is a compound based on Polyester, TP resin containing Carbon Fiber.
Flexural Modulus	17.0 GPa	2470 ksi	ASTM D790
Sumitomo Bakelite North America E 8398 Hardware Grade Epoxy Fiberglass and mineral reinforced epoxy molding compound with excellent dimensional stability, good electrical insulation properties, and good strength.Information provided by Vyncolit, a Sumitomo B..
Flexural Modulus	17.0 GPa	2470 ksi	ISO 178
Sumitomo Bakelite North America RXÂ® 660 Fiberglass Reinforced Phenolic Novolac RXÂ 660 is a fiberglass reinforced phenolic molding compound, with good dimensional stability and good strength at elevated temperatures. Meets ASTM D-5948 Type MFH.Information supplied by Sumitom..
Flexural Modulus	17.0 GPa	2470 ksi	ISO 178
SABIC Innovative Plastics LNP STAT-KON REF42 PA 66 LNP* STAT-KON* REF42 is a compound based on Nylon 66 resin containing 20% Glass Fiber, 10% Carbon Fiber. Added features of this material include: Electrically Conductive.
Flexural Modulus	17.0 GPa	2470 ksi	ISO 178
SABIC Innovative Plastics LNP VERTON UV00ASU PPA LNP* VERTON* UV00ASU is a compound based on Polyphthalamide resin containing 50% Long Glass Fiber. Added features of this material include: UV Stabilized, Heat Stabilized, Structural.
Flexural Modulus	17.0 GPa	2470 ksi	ISO 178
Vyncolit Neopreg Kinel® SK80 L8G Glass Fiber Reinforced Molding Compound Epoxy based molding compound long glass fiber reinforced with excellent long term property retention over a wide temperature range and climate conditions. It is particularly suited for over mold..
Flexural Modulus	17.0 GPa	2470 ksi	ISO 178
Vyncolit X640 Resole Phenolic Glass fiber filled phenolic molding compound with excellent mechanical and thermal properties.USES: Information provided by Vyncolit, a Sumitomo Bak Group
Flexural Modulus	17.0 GPa	2470 ksi	dry; ISO 178
DSM Stanyl® OCD2300 BLK PA46-GF50 50% Glass Reinforced, Heat Stabilized
Flexural Modulus	17.0 GPa	2470 ksi	DAM; ISO 178
DuPont Performance Polymers Zytel® HTN 55G55LWSF BK752A Polyphthalamide (PPA) 55% Glass Reinforced PPA High Performance Polyamide with Low Warpage and High Stiffness Information provided by DuPont Performance Polymers
Flexural Modulus	17.0 GPa	2470 ksi	transverse; ISO 178
Bond Laminates TEPEX® dynalite 104-RG600(x)/47% Roving Glass – PP Consolidated Composite Laminate Within the TEPEX® composite laminate, PP is a resin known for its good hardness, stiffness, abrasion resistance and chemical resistance.Typical application environments are within automotive applic..
Flexural Modulus	17.0 GPa	2470 ksi	dry; ISO 178
DSM Novamid® 3010CF30 BK PA66-CF30 30% Carbon Reinforced