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- CP-Polymer-Technik Wellamid® 6600/58 HWCP Nylon 66, Impact Modified Until -40°C, Heat Stabilized, Conditioned
CP-Polymer-Technik Wellamid® 6600/58 HWCP Nylon 66, Impact Modified Until -40°C, Heat Stabilized, Conditioned
| Category | Polymer , Thermoplastic , Nylon , Nylon 66 , Nylon 66, Impact Grade |
| Manufacturer | CP-Polymer-Technik GmbH & Co. |
| Trade Name | Wellamid® |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | CP-Polymer-Technik Wellamid® 6600/58 HWCP Nylon 66, Impact Modified Until -40°C, Heat Stabilized, Conditioned.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Information provided by CP-Polymer-Technik GmbH & Co. KG
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.07 g/cc | 0.0387 lb/in³ | ISO 1183 |
| Moisture Absorption at Equilibrium | 2.5 - 3.0 % | 2.5 - 3.0 % | 23°C/50%RH, Starting when dry; DIN 53495 |
| Linear Mold Shrinkage | 0.0080 - 0.012 cm/cm @Thickness 4.00 mm |
0.0080 - 0.012 in/in @Thickness 0.157 in |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Strength, Yield | 45.0 MPa | 6530 psi | 50 mm/min; ISO 527 |
| Elongation at Break | >= 50 % | >= 50 % | 50 mm/min; ISO 527 |
| Elongation at Yield | 32 % | 32 % | 50 mm/min; ISO 527 |
| Tensile Modulus | 1.00 GPa | 145 ksi | ISO 527 |
| Charpy Impact Unnotched | NB @Temperature 23.0 °C |
NB @Temperature 73.4 °F |
ISO 179 |
| Charpy Impact, Notched | NB @Temperature 23.0 °C |
NB @Temperature 73.4 °F |
ISO 179 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Melting Point | 255 °C | 491 °F | Kofler |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+12 ohm-cm | 1.00e+12 ohm-cm | IEC 93 |
| Surface Resistance | 1.00e+10 ohm | 1.00e+10 ohm | ISO 3915 |
| Dielectric Constant | 5.0 @Frequency 1e+6 Hz |
5.0 @Frequency 1e+6 Hz |
IEC 250 |
| Dielectric Strength | 30.0 kV/mm | 762 kV/in | IEC 243-1 |
| Dielectric Loss Index | 0.070 | 0.070 | At 1 MHz; IEC 250 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Melt Temperature | 260 - 280 °C | 500 - 536 °F | |
| Mold Temperature | 50.0 - 90.0 °C | 122 - 194 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Back Pressure | Low | |
| Holding Pressure | High | |
| Injection Speed | Medium to High | |
| Screw Speed | Medium |
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