POLYMER SEARCH

BCC Products HPX-850 Epoxy Backfill System

Category	Polymer , Thermoset , Epoxy
Manufacturer	BCC Products
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	BCC Products HPX-850 Epoxy Backfill System.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

HPX-850 is a light weight, heat resistant, two component epoxy backfill system. HPX-850 features advantages such as low cost, long pot life, machineability, and low shrinkage. HPX-850 is ideally suited for numerous applications involving mold and core construction.Information provided by BCC Products, Inc.

Physical Properties	Metric	English	Comments
Specific Gravity	0.820 g/cc	0.820 g/cc
Linear Mold Shrinkage	0.00020 cm/cm	0.00020 in/in	ASTM D2566-69

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	74 @Temperature 23.9 °C	74 @Temperature 75.0 °F
Compressive Strength	34.3 MPa	4980 psi

Thermal Properties	Metric	English	Comments
Deflection Temperature at 1.8 MPa (264 psi)	141 °C	285 °F

Processing Properties	Metric	English	Comments
Cure Time	1440 min @Temperature 24.0 °C	24.0 hour @Temperature 75.2 °F
Pot Life	120 - 150 min @Temperature 24.0 °C	120 - 150 min @Temperature 75.2 °F	1/2 lb. mass

Descriptive Properties	Value	Comments
Mix Ratio	6:1 by weight, resin/hardener
Mixed Viscosity, Brookfield	Thixotropic

Users viewing this material also viewed the following: