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BCC Products HPX-850 Epoxy Backfill System

Category Polymer , Thermoset , Epoxy
Manufacturer BCC Products
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF BCC Products HPX-850 Epoxy Backfill System.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
HPX-850 is a light weight, heat resistant, two component epoxy backfill system. HPX-850 features advantages such as low cost, long pot life, machineability, and low shrinkage. HPX-850 is ideally suited for numerous applications involving mold and core construction.Information provided by BCC Products, Inc.
Physical Properties Metric English Comments
Specific Gravity 0.820 g/cc
0.820 g/cc
Linear Mold Shrinkage 0.00020 cm/cm
0.00020 in/in
ASTM D2566-69
Mechanical Properties Metric English Comments
Hardness, Shore D 74

@Temperature 23.9 °C
74

@Temperature 75.0 °F
Compressive Strength 34.3 MPa
4980 psi
Thermal Properties Metric English Comments
Deflection Temperature at 1.8 MPa (264 psi) 141 °C
285 °F
Processing Properties Metric English Comments
Cure Time 1440 min

@Temperature 24.0 °C
24.0 hour

@Temperature 75.2 °F
Pot Life 120 - 150 min

@Temperature 24.0 °C
120 - 150 min

@Temperature 75.2 °F
1/2 lb. mass
Descriptive Properties Value Comments
Mix Ratio 6:1 by weight, resin/hardener
Mixed Viscosity, Brookfield Thixotropic
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