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Atom Adhesives AA-BOND FDA2 Epoxy Adhesive

Category Polymer , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Atom Adhesives
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Atom Adhesives AA-BOND FDA2 Epoxy Adhesive.pdf
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Material Notes:
AA-BOND FDA2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received Class VI approval. AA-BOND FDA2 is two part amber adhesive used and cured at room temperature for bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment and devices. AA-BOND FDA2 provides low permeability to gases and vapors, and good resistance to water, weather, petroleum solvents, lubricants, to mild acids and alkalis, and to many other organic and inorganic compounds.Appearance: Amber Cure Type: Heat cure or Room TemperatureBenefits:Medium viscosityClass VI approvedLow permeabilityGood resistanceEasily mixed Mix Ratio by weight: 100:100/Resin:HardenerSubstrates: Most metals, ceramic, glass and plastics. Typical Application: Bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices.Information provided by Atom Adhesives
Physical Properties Metric English Comments
Specific Gravity 1.11 g/cc
1.11 g/cc
uncured
Solids Content 100 %
100 %
reactive, uncured
Viscosity 12000 - 16000 cP
12000 - 16000 cP
uncured
Mechanical Properties Metric English Comments
Hardness, Shore D 79
79
Elongation at Yield 9.0 %
9.0 %
cured
Adhesive Bond Strength 12.4 MPa
1800 psi
Lap shear, alum to alum
Thermal Properties Metric English Comments
CTE, linear 52.9 µm/m-°C
29.4 µin/in-°F
Maximum Service Temperature, Air 145 °C
293 °F
Minimum Service Temperature, Air -70.0 °C
-94.0 °F
Glass Transition Temp, Tg 54.0 °C
129 °F
Electrical Properties Metric English Comments
Volume Resistivity 1.20e+14 ohm-cm
1.20e+14 ohm-cm
Dielectric Constant 3.4

@Frequency 1000 Hz
3.4

@Frequency 1000 Hz
Dielectric Strength 16.5 kV/mm
420 kV/in
Dissipation Factor 0.020

@Frequency 1000 Hz
0.020

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 60.0 - 240 min

@Temperature 65.0 °C
1.00 - 4.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 45.0 min
45.0 min
uncured
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