Arlon EP2 Enhanced Polyimide Laminate and Prepreg

High reliability and high temperature materialEP2 Enhanced Polyimide is the next generation of polyimide and prepreg products, engineered for improved properties and processing and for applications requiring optimum thermal performance. EP2 is a filled product, yet with significantly improved copper adhesion compared to traditional polyimides. Reduced water absorption, higher thermal conductivity and reduced CTE are all achieved while maintaining the full 250°C Tg of polyimide for thermal stability through process and application. Reduced cure cycle compared to traditional polyimides offers reduced process times throughout.Lower electrical loss results in improved signal integrityToughened, non-MDA chemistry resists drill fracturingFully compatible with lead-free solder processingTypical Applications:PCBs that are subjected to high temperatures during processing and rework, such as lead-free soldering. Reduced risk of latent PTH damage due to low Z-direction CTEApplications with significant service life expectations at high temperatures, such as aircraft engine instrumentation, on-engine applications, down-hole drilling and industrial sensor packages, under-hood automotive controls and burn-in testing of ICs (Burn-in-Boards)This data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.