Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound

Category	Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer	Aptek Laboratories
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Optoelectronic grade encapsulant/potting compound – will not attack/cloud polysulphone casings. Lower Tg version, APTEK 6110-A/B, available for ceramic blob-top applications.Part A is hazy blue. Part B is water clear.Information provided by Aptek Laboratories, Inc.

Physical Properties	Metric	English	Comments
Density	0.950 g/cc	0.0343 lb/in³	B Component; ASTM D1475
	1.16 g/cc	0.0419 lb/in³	A Component; ASTM D1475
Viscosity	25 cP	25 cP	B Component; Spindle #1; speed 100 rpm; ASTM D1824
	2000 cP	2000 cP	A Component; Spindle #3; speed 10 rpm; ASTM D1824

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	85	85	Cured property; ASTM D2240

Thermal Properties	Metric	English	Comments
CTE, linear	79.0 µm/m-°C @Temperature 20.0 °C	43.9 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 1; Perkin Elmer TMS-2
	175 µm/m-°C @Temperature 20.0 °C	97.2 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 2; Perkin Elmer TMS-2
Glass Transition Temp, Tg	>= 135 °C	>= 275 °F	Cured property; Perkin Elmer TMS-2
Flash Point	>= 100 °C	>= 212 °F	B Component; ASTM D92
	>= 200 °C	>= 392 °F	A Component; ASTM D92

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+15 ohm-cm	>= 1.00e+15 ohm-cm	Cured property; ASTM D257

Users viewing this material also viewed the following: