Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Aptek Laboratories
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Optoelectronic grade encapsulant/potting compound – will not attack/cloud polysulphone casings. Lower Tg version, APTEK 6110-A/B, available for ceramic blob-top applications.Part A is hazy blue. Part B is water clear.Information provided by Aptek Laboratories, Inc.
Physical Properties Metric English Comments
Density 0.950 g/cc
0.0343 lb/in³
B Component; ASTM D1475
1.16 g/cc
0.0419 lb/in³
A Component; ASTM D1475
Viscosity 25 cP
25 cP
B Component; Spindle #1; speed 100 rpm; ASTM D1824
2000 cP
2000 cP
A Component; Spindle #3; speed 10 rpm; ASTM D1824
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
Cured property; ASTM D2240
Thermal Properties Metric English Comments
CTE, linear 79.0 µm/m-°C

@Temperature 20.0 °C
43.9 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 1; Perkin Elmer TMS-2
175 µm/m-°C

@Temperature 20.0 °C
97.2 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 2; Perkin Elmer TMS-2
Glass Transition Temp, Tg >= 135 °C
>= 275 °F
Cured property; Perkin Elmer TMS-2
Flash Point >= 100 °C
>= 212 °F
B Component; ASTM D92
>= 200 °C
>= 392 °F
A Component; ASTM D92
Electrical Properties Metric English Comments
Volume Resistivity >= 1.00e+15 ohm-cm
>= 1.00e+15 ohm-cm
Cured property; ASTM D257
Copyright © lookpolymers.com All Rights Reserved