Category | Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced |
Manufacturer | Aptek Laboratories |
Trade Name | |
Port | Ningbo port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Aptek 6103-A/B Epoxy Encapsulant.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.16 g/cc | 0.0419 lb/in³ | A Component; ASTM D1475 |
1.20 g/cc | 0.0434 lb/in³ | B Component; ASTM D1475 | |
Brookfield Viscosity | 360 cP | 360 cP | B Component; Spindle #2; speed 50 rpm; ASTM D1824 |
2000 cP | 2000 cP | A Component; Spindle #3; speed 10 rpm; ASTM D1824 |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Shore D | 87 | 87 | Cured property; ASTM D2240 |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 72.0 µm/m-°C @Temperature 20.0 °C |
40.0 µin/in-°F @Temperature 68.0 °F |
Cured property; alpha 1; Perkin Elmer TMS-2 |
188 µm/m-°C @Temperature 20.0 °C |
104 µin/in-°F @Temperature 68.0 °F |
Cured property; alpha 2; Perkin Elmer TMS-2 | |
Glass Transition Temp, Tg | 130 °C | 266 °F | Cured property; Perkin Elmer TMS-2 |
Flash Point | >= 150 °C | >= 302 °F | B Component; ASTM D92 |
>= 200 °C | >= 392 °F | A Component; ASTM D92 |
Optical Properties | Metric | English | Comments |
---|---|---|---|
Transmission, Visible | 0.00 % | 0.00 % | opaque; thickness not quantified |
IR Transmittance | 90 % | 90 % | transparent; thickness not quantified |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Volume Resistivity | 5.00e+15 ohm-cm | 5.00e+15 ohm-cm | Cured property; ASTM D257 |
Dielectric Constant | 3.1 @Frequency 1000 Hz |
3.1 @Frequency 1000 Hz |
Cured property; ASTM D150 |
Dissipation Factor | 0.010 @Frequency 1000 Hz |
0.010 @Frequency 1000 Hz |
Cured property; ASTM D150 |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Processing Temperature | 115 °C | 239 °F | Cure 12 hrs. |