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- AIM 35.7Sn/35.7Pb/28.6Bi Solder for Photonic Packaging
AIM 35.7Sn/35.7Pb/28.6Bi Solder for Photonic Packaging
| Category | Metal , Nonferrous Metal , Lead Alloy , Solder/Braze Alloy , Tin Alloy |
| Manufacturer | AIM Specialty Materials |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | AIM 35.7Sn/35.7Pb/28.6Bi Solder for Photonic Packaging.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 9.34 g/cc | 0.337 lb/in³ |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Strength, Ultimate | 165 MPa | 24000 psi |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 20.0 µm/m-°C @Temperature 20.0 °C |
11.1 µin/in-°F @Temperature 68.0 °F |
|
| Melting Point | 100 °C | 212 °F | |
| Solidus | 100 °C | 212 °F | |
| Liquidus | 100 °C | 212 °F |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Bismuth, Bi | 28.6 % | 28.6 % | |
| Lead, Pb | 35.7 % | 35.7 % | |
| Tin, Sn | 35.7 % | 35.7 % |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Creep Resistance | Low |
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