Hexcel® Redux® 308 Modified epoxy film adhesive

Category	Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Hexcel
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Hexcel® Redux® 308 Modified epoxy film adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Redux 308 is a high-strength film adhesive curing at 350°F. It is suitable for a wide range of structural bonding applications including metal to metal bonding and sandwich constructions, where operating temperatures of up to 250°F may be experienced.Features: Cures at 350°F; Good structural performance and service temperature up to 250°F; Excellent environmental resistance; Superior aging performance for continuous operation up to 250°F; Low volatile content (solventless process).Applications: Metal to metal bonding; Structural sandwich constructions

Mechanical Properties	Metric	English	Comments
Tensile Strength, Yield	8.00 MPa @Temperature 21.1 °C	1160 psi @Temperature 70.0 °F	Flatwise Tensile
Shear Strength	20.0 MPa @Temperature 121 °C	2900 psi @Temperature 250 °F	Lap Shear
	43.4 MPa @Temperature 71.1 °C	6300 psi @Temperature 160 °F	Lap Shear
	46.9 MPa @Temperature 21.1 °C	6800 psi @Temperature 70.0 °F	Lap Shear
Peel Strength	4.73 kN/m @Temperature 21.1 °C	27.0 pli @Temperature 70.0 °F	Bell Peel

Processing Properties	Metric	English	Comments
Shelf Life	12.0 Month @Temperature -17.8 °C	12.0 Month @Temperature 0.000 °F

Descriptive Properties	Value	Comments
Areal Weight (psf)	0.06
Roll Width (in)	39
Standard Roll (ft2)	540

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