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Hexcel® Redux® 308 Modified epoxy film adhesive

Category Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Hexcel
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexcel® Redux® 308 Modified epoxy film adhesive.pdf
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Material Notes:
Redux 308 is a high-strength film adhesive curing at 350°F. It is suitable for a wide range of structural bonding applications including metal to metal bonding and sandwich constructions, where operating temperatures of up to 250°F may be experienced.Features: Cures at 350°F; Good structural performance and service temperature up to 250°F; Excellent environmental resistance; Superior aging performance for continuous operation up to 250°F; Low volatile content (solventless process).Applications: Metal to metal bonding; Structural sandwich constructions
Mechanical Properties Metric English Comments
Tensile Strength, Yield 8.00 MPa

@Temperature 21.1 °C
1160 psi

@Temperature 70.0 °F
Flatwise Tensile
Shear Strength 20.0 MPa

@Temperature 121 °C
2900 psi

@Temperature 250 °F
Lap Shear
43.4 MPa

@Temperature 71.1 °C
6300 psi

@Temperature 160 °F
Lap Shear
46.9 MPa

@Temperature 21.1 °C
6800 psi

@Temperature 70.0 °F
Lap Shear
Peel Strength 4.73 kN/m

@Temperature 21.1 °C
27.0 pli

@Temperature 70.0 °F
Bell Peel
Processing Properties Metric English Comments
Shelf Life 12.0 Month

@Temperature -17.8 °C
12.0 Month

@Temperature 0.000 °F
Descriptive Properties Value Comments
Areal Weight (psf) 0.06
Roll Width (in) 39
Standard Roll (ft2) 540
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